Conductive Particle with Solder Surface Layer for Reliable Circuit Connections
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Solution Overview
Problem
Existing anisotropic conductive adhesive technologies face reliability issues in maintaining consistent electrical connections between circuit members due to the deformation of resin particles under thermal compression, leading to reduced contact areas and potential failures like short circuits.
Innovation Solution
A conductive particle with a core resin material and a surface layer of solder material, where the melting point of the solder is equal to or lower than the softening point of the resin, is used in a connection material that includes an adhesive, allowing for a solder portion to form between electrodes, maintaining a large contact area and preventing cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin particle with a nickel-plated layer is used as a conductive particle, then electrical connection is achieved, but the contact area reduces due to deformation under thermal compression
Solution Approach 1:
The patent changes the material parameter of the surface layer from nickel plating to solder material, and changes the melting point parameter to be lower than or equal to the resin softening point. This allows the solder to melt and flow during thermal compression, maintaining large contact area with the electrode surfaces while ensuring reliable electrical connection.
Solution Approach 2:
The patent utilizes the phase transition of solder material from solid to liquid during thermal compression. The solder melts at a temperature lower than or equal to the resin softening point, flows to form large contact areas with the electrodes, then solidifies upon cooling to create robust electrical connections that maintain large contact areas.
2Reliability
If thermal compression is applied to connect circuit members, then electrical connection is formed, but thermal stress causes deformation and potential short circuits
Solution Approach 1:
The patent changes the melting point parameter of the conductive material to be lower than or equal to the resin softening point. This allows the connection process to occur at lower temperatures, reducing thermal stress on the circuit members and preventing deformation and short circuits while still achieving reliable electrical connections.
3Manufacturing precision
If the contact area is reduced due to resin particle deformation, then connection precision is affected, but increasing particle size increases deformation
Solution Approach 1:
The patent utilizes the phase transition of solder material to overcome particle deformation issues. The solder melts during thermal compression, flows to conform to the electrode surfaces, and maintains large contact areas regardless of the resin particle size or deformation, thereby ensuring high connection precision.
Solution Approach 2:
The patent uses a composite structure with a resin core particle and a solder material surface layer. The resin provides structural support while the solder material provides the conductive function and large contact area, combining the advantages of both materials to achieve high connection precision without particle deformation issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of electrical connections by maintaining a large contact area and preventing failures such as short circuits, while reducing thermal stress through low-temperature thermal compressing processes.
Implementation Method 1
a solder material melting process of melting the solder material by heating the second circuit member while pressing the second circuit member to the first circuit member
Implementation Method 2
a contact area between the first electrode and the second electrode of the melted solder material is widened by raising a temperature of the resin material to be equal to or higher than the softening point of the resin material and by compressing the core particle
Implementation Method 3
The first circuit member and the second circuit member adhere to each other by the anisotropic conductive adhesive
Data Source
AI summary
There is provided a conductive particle including a core particle containing a resin material, and a surface layer that covers a surface of the core particle and contains a solder material, in which a melting point of the solder material is equal to or lower than a softening point of the resin material.