Conductive Particle Transfer via Microcavity Mold for Short Circuit Prevention
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Solution Overview
Problem
In high-density electronic component mounting, the miniaturization of connecting terminals and narrowing of terminal intervals lead to issues with electrically conductive particles causing short circuits due to random dispersion in anisotropic conductive films, and existing methods to decrease particle size or form insulating films on particles are inadequate in preventing short circuits and ensuring proper particle capture.
Innovation Solution
A method involving filling a solvent and electrically conductive particles into microcavities on a substrate in a predetermined pattern, applying a binder resin layer, and transferring the particles to the layer by peeling and heating, ensuring precise alignment and attachment to prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrically conductive particles are randomly dispersed in the binder resin, then the anisotropic conductive film can be manufactured with simple process, but the particles may link between micro terminals causing short circuits
Solution Approach 1:
The patent applies preliminary action by pre-forming microcavities in a mold before injecting the binder resin and conductive particles. The microcavities are created in advance to control particle placement, preventing random dispersion that causes short circuits while maintaining manufacturing efficiency through a single-step injection process
2Reliability
If the particle size of electrically conductive particles is decreased, then the risk of short circuit between terminals is reduced, but the particle capture rate on microminiaturized connecting terminal decreases
Solution Approach 1:
The patent applies local quality by creating microcavities with specific local dimensions (smaller than the connecting terminal pitch) that are strategically positioned to match the terminal arrangement. This local structural differentiation allows smaller particles to be effectively captured and positioned without requiring a complete reduction in particle size, thus maintaining both short circuit prevention and adequate capture rate
3Reliability
If an insulating film is formed on the particle surface, then short circuit between terminals is prevented, but it is not possible to completely prevent short circuit and the manufacturing complexity increases
Solution Approach 1:
The patent applies the taking out principle by extracting the particle placement control function from the particle surface treatment approach and implementing it through the mold cavity structure instead. Rather than modifying particle surfaces with insulating films, the invention uses the physical structure of microcavities to control particle positioning, thereby preventing short circuits through spatial separation rather than surface insulation
4Productivity
If the interval between adjacent connecting terminals is narrowed for high density mounting, then the miniaturization requirement is met, but the electrically conductive particles are more likely to link and cause short circuits
Solution Approach 1:
The patent applies preliminary action by pre-defining the precise positions and dimensions of microcavities in the mold to match the narrowed terminal pitch for high-density mounting. The microcavities are designed in advance with intervals smaller than the terminal pitch, ensuring that particles are positioned correctly even when terminals are closely spaced, thus enabling high-density mounting while preventing short circuits
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method securely transfers and attaches conductive particles to the binder resin layer, preventing short circuits and maintaining high particle capture rates even on microminiaturized terminals, thus supporting high-density mounting requirements.
Implementation Method 1
the substrates 51 and 54 are heat-pressurized from the top of the flexible substrate 51 by a heating and pressing head 56. By virtue of this, as illustrated in FIG. 5(B), the binder resin becomes fluid
Implementation Method 2
the electrically conductive particles in the anisotropic conductive film 53 are pressed and deformed by being sandwiched between the two connecting terminals
Data Source
AI summary
Methods for securely transferring and attaching electrically conductive particles filled in openings to a binder resin layer. The methods include a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.