Conductive Partition for Active Device Alignment
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Solution Overview
Problem
The misalignment of partitions relative to electrodes in active devices with organic semiconductor layers, particularly when using flexible substrates that expand or contract during thermal processes, leads to increased device size and ink spread variability.
Innovation Solution
Forming partitions out of conductive materials, such as copper, which allows for simultaneous formation with electrodes and reduces misalignment, thereby controlling the spread of organic semiconductor ink effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If partitions are formed using liquid-repellent insulating material containing fluorinated component, then ink spread is controlled, but misalignment with electrodes occurs and device size increases
Solution Approach 1:
The partition and electrode are merged into a single integrated structure formed from the same conductive material layer. This eliminates the need for separate formation processes and ensures perfect alignment between the partition and electrode, resolving the misalignment issue while maintaining compact device dimensions.
Solution Approach 2:
The conductive material layer serves dual functions: forming the electrode for electrical contact and forming the partition for ink confinement. This multi-functionality eliminates the need for a separate partition structure, reducing device area while maintaining manufacturing precision.
2Manufacturing precision
If partitions are formed in addition to electrodes, then ink spread is controlled, but manufacturing process complexity increases
Solution Approach 1:
The partition formation is merged with the electrode formation process. Both structures are created simultaneously from the same conductive material layer in a single manufacturing step, eliminating the need for additional partition formation processes and reducing overall manufacturing complexity.
Solution Approach 2:
The conductive material layer performs multiple functions: providing electrical conductivity for the electrode and providing physical barriers for ink confinement as partitions. This multi-functionality reduces the number of manufacturing steps required while maintaining effective ink spread control.
3Adaptability or versatility
If flexible substrates are used, then device flexibility is improved, but substrate expansion or contraction causes misalignment
Solution Approach 1:
The partition and electrode are merged into an integrated structure formed from the same conductive material layer. This ensures they move together as a unit when the flexible substrate expands or contracts, maintaining alignment precision despite substrate deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach eliminates the need for an additional step in manufacturing and reduces ink spread beyond the partitions, maintaining device precision and efficiency even after thermal processes, resulting in smaller and more reliable active devices.
Implementation Method 1
Insulating materials containing fluorinated components, such as polytetrafluoroethylene (PTFE), are suitable as partition materials because of their low wettability to organic semiconductor inks.
Implementation Method 2
the partition preferably has a lower wettability than the substrate. This allows the organic semiconductor ink to be easily disposed inside the partition in the planar direction while spreading moderately over the substrate.
Data Source
AI summary
[Object]The present invention provides an active device in which the misalignment of a partition relative to electrodes is reduced and a method for manufacturing an active device.[Solution]An active device according to the present invention includes a substrate 2, a first electrode 5 and a second electrode 6 formed adjacent to each other on one main surface of the substrate 2, an organic semiconductor layer 9 formed on the one main surface of the substrate 2 at least over a region between the first electrode 5 and the second electrode 6, and a partition 12 formed on the one main surface of the substrate 2 in a region that is located outside the organic semiconductor layer 9 in a planar direction and that is different from regions where the first electrode 5 and the second electrode 6 are formed. The partition 12 is formed of a conductive material.