Conductive Paste Composition Balancing Conductivity and Adhesion
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Solution Overview
Problem
Conductive pastes face a challenge in achieving a balance between conductivity and adhesive strength, as increasing the amount of conductive particles to reduce contact resistance often compromises the adhesive properties of the cured product.
Innovation Solution
A conductive paste composition comprising epoxy resin, a latent curing agent, and plate-like crystalline metal powder with a specific particle diameter range, along with optional components, to enhance both conductivity and adhesive strength in the cured product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the amount of conductive particles is increased to reduce contact resistance, then conductivity is improved, but adhesive strength deteriorates
Solution Approach 1:
The patent changes the particle size parameter of conductive particles to a specific range (0.6-1.4 μm average diameter) to optimize both conductivity and adhesive strength. This parameter optimization allows sufficient particle-particle contact for conductivity while maintaining adequate resin content for adhesion.
Solution Approach 2:
The patent uses a composite material system combining epoxy resin with plate-like crystalline metal particles of specific morphology. The composite structure allows the resin matrix to provide adhesion while the conductive particles provide electrical pathways, achieving both functions simultaneously.
2Reliability
If the amount of resin component is reduced to increase conductive particle ratio, then conductivity is improved, but adhesive strength deteriorates
Solution Approach 1:
The patent optimizes the particle size parameter to 0.6-1.4 μm, which allows achieving high conductivity with a lower particle concentration. This reduces the need for excessive resin reduction while maintaining good electrical properties.
Solution Approach 2:
The plate-like morphology of particles provides localized conductive pathways that are efficient for electrical conduction. This local quality optimization allows effective conductivity with fewer particles, preserving more resin for adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a well-balanced improvement in conductivity and adhesive strength, ensuring effective electrical conduction and adhesion in electronic components, particularly those with nickel-plated surfaces.
Implementation Method 1
resistance (volume resistivity) of a resin (conductive paste) itself in terms of conductivity
Implementation Method 2
component (A): an epoxy resin; component (B) a latent curing agent
Data Source
AI summary
A conductive paste contains the following components (A) to (C): component (A): an epoxy resin; component (B): a latent curing agent; and component (C): a plate-like crystalline metal powder having an average particle diameter of 0.6 to 1.4 μm. According to one embodiment of the present invention, a conductive paste can achieve both conductivity and adhesive strength in resulting cured product.