Conductive Paste Binder System for Multi-Layered Ceramic Components
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Solution Overview
Problem
The existing methods for forming conductive paste for multi-layered ceramic electronic components often result in short circuit failures due to the dissolution of binders in the ceramic green sheet, leading to pinholes and cracks, especially when the sheets are thin, and existing solutions fail to maintain printability and prevent defects effectively.
Innovation Solution
A conductive paste is developed using a binder with ethyl cellulose having a specific weight average molecular weight ratio and solvents like isobornyl acetate, which prevents the dissolution of the binder in the ceramic green sheet, ensuring reliable prevention of short circuit failures and maintaining excellent printability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If terpineol is used as the solvent for conductive paste, then the conductive paste has good printability and dissolves the binder component, but the binder in the ceramic green sheet is dissolved causing pinholes and cracks that lead to short circuit failure
Solution Approach 1:
The patent changes the chemical parameters of the solvent system by replacing terpineol with a mixed solvent system comprising isobornyl acetate (5-30 wt%) and d-dihydrocarveol (70-45 wt%). This parameter change allows the conductive paste to maintain printability while preventing binder dissolution in the ceramic green sheet, thereby eliminating pinholes and cracks that cause short circuit failure.
Solution Approach 2:
The patent uses a composite solvent system combining isobornyl acetate and d-dihydrocarveol in specific proportions. This composite approach leverages the complementary properties of both solvents: isobornyl acetate provides good printability and controlled dissolution, while d-dihydrocarveol prevents excessive binder dissolution and maintains structural integrity of the ceramic green sheet.
2Volume of moving object
If the ceramic green sheet is made thinner to downsize the component, then the electronic device size is reduced, but the binder dissolution and short circuit failure risk increases
Solution Approach 1:
The patent changes the chemical composition parameters of the conductive paste solvent system to be non-aggressive toward the binder in thin ceramic green sheets. The mixed solvent system of isobornyl acetate and d-dihydrocarveol provides controlled interaction with the binder, enabling the use of very thin ceramic green sheets (3 μm or less) without causing pinholes and cracks that would lead to short circuit failure.
3Reliability
If a hydrocarbon system solvent like kerosene or decane is used, then the binder dissolution is reduced, but the viscosity control becomes difficult and the solvent cannot completely replace conventional solvents
Solution Approach 1:
The patent creates a composite solvent system combining isobornyl acetate and d-dihydrocarveol that achieves both low binder dissolution and controllable viscosity. This composite approach overcomes the limitations of hydrocarbon solvents by providing both reliability in preventing binder dissolution and ease of manufacture through controllable viscosity characteristics.
Solution Approach 2:
The patent optimizes the concentration ratios of isobornyl acetate (5-30 wt%) and d-dihydrocarveol (70-45 wt%) to achieve the desired balance between binder dissolution prevention and viscosity control. By adjusting these parameters, the conductive paste maintains manufacturability while preventing the binder dissolution issues associated with conventional solvents.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short circuit failures and ensures the formation of a stable electrode layer on very thin ceramic green sheets, enhancing the reliability and performance of multi-layered ceramic electronic components by maintaining the integrity of the ceramic green sheet and ensuring proper printability.
Implementation Method 1
the binder contained in the ceramic green sheet is dissolved by terpineol contained in the conductive paste and a ceramic green sheet is swollen or partially dissolved
Data Source
AI summary
It is an object of the present invention to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can reliably prevent short circuit failure from occurring in a multi-layered ceramic electronic component and form an electrode layer in a desired manner.A method for manufacturing a multi-layered ceramic electronic component includes a step of printing a conductive paste containing a binder containing ethyl cellulose having a weight average molecular weight of MWL and ethyl cellulose having a weight average molecular weight of MWH at a weight ratio of X:(1−X), where MWL, MWH and X are selected so that X*MWL+(1−X)*MWH falls within a range of 145,000 to 215,000 and at least one solvent selected from the group consisting of isobornyl acetate, dihydroterpinyl methyl ether, dihydroterpinyl oxyethanol, terpinyl methyl ether, terpinyl oxyethanol, d-dihydrocarveol, I-menthyl acetate, I-citronellol, I-perillylalcohol and acetoxy-methoxyethoxy-cyclohexanol acetate on a ceramic green sheet containing an acrylic system resin as a binder in a predetermined pattern, thereby forming an electrode layer.