Conductive Paste Coating for Uniform Capacitor Polymer Layers
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Solution Overview
Problem
Current capacitor technologies face issues with leakage and short circuits due to the formation of holes on the conductive polymer layer surface, poor film-forming properties, and difficulty in controlling thickness and uniformity, which affect the flatness and stackability of the capacitor element.
Innovation Solution
A conductive paste comprising a conductive composite material powder and resin is formulated by grinding a conductive composite material in a solid state, followed by chemical polymerization and mixing with a resin, and applied in a capacitor element to form a conductive layer that fills surface holes and improves film-forming properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple impregnations and multiple cycles are used to form the conductive polymer layer, then the conductivity is improved, but the operation complexity increases significantly
Solution Approach 1:
The patent combines multiple impregnation cycles and polymerization steps into a single integrated coating process. The conductive paste containing pre-formed conductive polymer particles is applied in one step, eliminating the need for repeated impregnation and polymerization cycles, thus reducing operational complexity while maintaining conductivity.
Solution Approach 2:
The conductive polymer is pre-formed into particles or paste before application. This preliminary preparation allows the conductive material to be directly applied without requiring in-situ polymerization during the manufacturing process, significantly simplifying the operational steps while ensuring consistent conductivity.
2Reliability
If the conductive polymer layer is formed by conventional methods, then the conductivity is achieved, but the film-forming property deteriorates with holes forming on the surface
Solution Approach 1:
The patent uses a composite paste formulation containing conductive polymer particles mixed with binders and solvents. This composite structure allows the paste to form a continuous, hole-free film when applied, as the binder matrix fills in potential voids while the conductive particles provide the necessary electrical conductivity throughout the layer.
Solution Approach 2:
The patent modifies the physical state and composition parameters of the conductive material by converting it into a paste form with specific viscosity and particle size distribution. This parameter optimization enables better flow and leveling properties during application, resulting in a uniform film without holes while maintaining conductivity.
3Reliability
If the conductive polymer layer thickness and uniformity are difficult to control, then the conductivity may be compromised, but the flatness and stackability of the capacitor element are affected
Solution Approach 1:
The patent replaces complex multi-step mechanical impregnation processes with a simpler coating method using conductive paste. The paste can be applied using standard coating techniques (such as screen printing, paste printing, or dip coating) that provide better control over thickness and uniformity, eliminating the variability associated with multiple impregnation cycles.
4Reliability
If conventional conductive polymer formation methods are used, then the conductivity is achieved, but the leakage and short circuit problems increase due to holes on the surface
Solution Approach 1:
The use of composite paste formulation with binder and conductive particle mixture creates a dense, continuous film structure that eliminates holes and voids. This composite structure provides both the necessary conductivity and a barrier against leakage and short circuits, as the binder matrix seals the surface while conductive particles maintain electrical pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive paste enhances capacitor performance by reducing leakage and short circuits, improving flatness, mechanical strength, and manufacturing efficiency through high thixotropic index and viscosity, allowing for precise coating and reduced impregnation cycles.
Implementation Method 1
A polymerization step is performed, wherein a conductive polymer, an oxidizing agent and an inhibitor are mixed and chemically polymerized to form the conductive composite material
Data Source
AI summary
A conductive paste, a manufacturing method of a conductive paste, a capacitor element and a manufacturing method of a capacitor element are provided. The conductive paste includes a conductive composite material powder and a resin. The conductive composite material powder is obtained by grinding a conductive composite material in a solid state. The resin is mixed with the conductive composite material powder.