Conductive Paste Composition for Stronger Electronic Component Bonding
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Solution Overview
Problem
Current manufacturing processes and conductive pastes often fail to provide sufficient adhesion between electrical components and conductive paste layers, leading to defects in electronic devices.
Innovation Solution
A conductive paste composition comprising 100 parts by weight of metal powder, 5 to 20 parts by weight of solvent, and 0.05 to 3 parts by weight of a polymer with specific molecular weight ranges, along with a solvent comprising two solvents with different boiling points, is applied to an electrically conductive substrate, and the electrical component is mounted and heated to bond effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional conductive paste and manufacturing processes are used, then the manufacturing process is simple, but the adhesion between electrical component and conductive paste layer is insufficient
Solution Approach 1:
The conductive paste uses a composite polymer system comprising a first polymer with molecular weight 5,000-95,000 and a second polymer with molecular weight 100,000-300,000. This composite material approach combines the benefits of different molecular weight polymers to achieve optimal adhesion strength while maintaining manageable composition complexity.
Solution Approach 2:
The invention optimizes the molecular weight parameters of the polymer components within specific ranges (first polymer: 5,000-95,000, second polymer: 100,000-300,000). By controlling these molecular weight parameters, the paste achieves enhanced adhesion properties without requiring overly complex compositional changes.
2Strength
If conventional conductive paste is used, then the paste composition is simple, but the bonding strength between electrical component and substrate is insufficient
Solution Approach 1:
The conductive paste employs a composite polymer system with two distinct polymer components having different molecular weight ranges. This composite structure enables synergistic effects that enhance bonding strength while keeping the compositional complexity at a manageable level through controlled material selection.
Solution Approach 2:
The invention specifies precise molecular weight ranges for the polymer components (first polymer: 5,000-95,000, second polymer: 100,000-300,000) to optimize bonding strength. This parameter control approach achieves enhanced bonding performance without requiring excessive compositional complexity.
3Strength
If conventional heating process is used, then the heating process is simple, but the adhesion and bonding strength are insufficient
Solution Approach 1:
The invention optimizes the molecular weight parameters of the polymer components within specific ranges to enable effective bonding at standard heating temperatures. This parameter optimization allows the paste to achieve enhanced adhesion and bonding strength without requiring complex or extreme heating processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enhances the adhesion between the electrical component and the conductive paste layer, improving the bonding process and reducing defects in electronic devices by maintaining a desirable level of tackiness and bonding strength.
Implementation Method 1
heating the conductive paste to bond the electrically conductive layer and the electrical component
Implementation Method 2
The electrically conductive layer of the substrate and the electrical component are bonded by the conductive paste
Data Source
AI summary
A method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; mounting an electrical component on the applied conductive paste; heating the conductive paste to bond the electrically conductive layer and the electrical component, wherein the conductive paste comprises 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.