Conductive Paste Composition for Low Shrinkage Electrodes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conductive paste compositions used in FPCs and solar cells face issues with high viscosity due to common binders and crosslinking agents, leading to excessive shrinkage and internal stress during curing, which can cause deformation or breakage of electrodes and underlying objects.
Innovation Solution
A conductive paste composition comprising a reactive oligomer binder with a siloxane bond and multiple oxirane rings, an epoxy monomer, a crosslinking agent with heat latent properties, and a high content of conductive filler, which reduces shrinkage and internal stress while maintaining low electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If rubber is used as a binder in the conductive paste composition, then shrinkage and internal stress are reduced, but viscosity increases and fine printing cannot be performed
Solution Approach 1:
The patent changes the chemical composition parameters of the binder by using a siloxane-based reactive oligomer with specific molecular weight (1,000-10,000) and siloxane bond content (70-90 mass%), which fundamentally alters the viscosity-shrinkage relationship compared to conventional rubber binders
Solution Approach 2:
The patent creates a composite binder system combining siloxane-based reactive oligomer with specific crosslinking agents that achieve both low viscosity and low shrinkage through synergistic material combination
2Object-generated harmful factors
If conductive filler content is reduced to lower viscosity, then fine printing can be performed, but electrical resistance increases
Solution Approach 1:
The patent changes the binder's molecular weight parameter to a specific range (1,000-10,000) that optimizes the balance between viscosity and conductive filler loading capacity, enabling high filler content with printable viscosity
3Reliability
If high content of conductive filler is used to maintain low electrical resistance, then electrical performance is improved, but viscosity increases and printing becomes difficult
Solution Approach 1:
The patent optimizes the siloxane bond content parameter (70-90 mass%) and molecular weight parameter of the binder to achieve minimum viscosity at high conductive filler concentrations, enabling both electrical performance and printability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for fine printing with low electrical resistance and minimal shrinkage and stress, ensuring the integrity of electrodes and substrates during curing and firing processes.
Implementation Method 1
a reactive oligomer binder with a siloxane bond and multiple oxirane rings, an epoxy monomer, and a crosslinking agent with heat latent properties
Implementation Method 2
the binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and comprising a plurality of oxirane rings as an organic group
Implementation Method 3
the conductive paste compositions shrink during curing and have internal stress even after firing
Implementation Method 4
the conductive paste compositions shrink during curing and have internal stress even after firing
Data Source
AI summary
A conductive paste composition includes 1 to 10 parts by weight of a binder (A), 2 to 20 parts by weight of an epoxy monomer (B), 1 to 20 parts by weight of a crosslinking agent (C), and 70 to 95 parts by weight of a conductive filler (D). The binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and including a plurality of oxirane rings as an organic group. The epoxy monomer (B) includes an oxirane ring. The total amount of the binder (A), the epoxy monomer (B), the crosslinking agent (C), and the conductive filler (D) is 100 parts by weight.