Conductive Paste Migration Inhibitor Dispersion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional conductive pastes with migration inhibitors face challenges in achieving uniform dispersion and compatibility with resins, leading to inadequate insulation reliability and limited versatility in silver-containing metal wiring, especially with the miniaturization of semiconductor components.
Innovation Solution
A conductive paste comprising silver particles and a specific migration inhibitor, formulated in a predetermined amount, which enhances dispersibility and conductivity while preventing ion migration, with the migration inhibitor content ranging from 12 to 40 parts by mass based on 100 parts of silver particles, and optionally including a resin for improved adherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin layer containing a migration inhibitor is disposed to cover the metal wiring, then ion migration is prevented, but the migration inhibitor has low compatibility with resins and cannot be dispersed uniformly, leading to insufficient insulation reliability
Solution Approach 1:
The migration inhibitor is incorporated into the conductive paste before the silver particles are applied to the substrate. This preliminary incorporation ensures that the migration inhibitor is present in the silver layer from the beginning, eliminating the need for a separate resin layer application step and ensuring uniform distribution throughout the silver wiring structure.
Solution Approach 2:
The invention combines the migration inhibitor with the conductive paste material itself, merging the function of conductivity (provided by silver particles) and migration inhibition into a single integrated material system. This eliminates the need for separate resin layer application and ensures uniform distribution of the migration inhibitor throughout the silver layer.
2Reliability
If a resin layer containing a migration inhibitor is used, then ion migration is inhibited, but the selection of resin is limited due to adherence and compatibility requirements, resulting in poor versatility
Solution Approach 1:
The conductive paste formulation with incorporated migration inhibitor can be used with various types of substrates and resin systems. The migration inhibitor is integrated into the paste itself, making it universally applicable regardless of the specific resin or substrate type, thereby eliminating the limitations on material selection and improving versatility.
3Volume of moving object
If the width and space of metal wiring are reduced for miniaturization, then component size is reduced, but insulation reliability between silver-containing metal wiring becomes insufficient
Solution Approach 1:
The migration inhibitor is incorporated into the conductive paste before application, ensuring that even when wiring is miniaturized to narrow dimensions, the inhibition function is present from the beginning and distributed uniformly throughout the reduced cross-section of the wiring, maintaining insulation reliability at smaller scales.
Data Source
AI summary
A conductive paste which can form a silver layer and a printed wiring board having a silver layer formed of the conductive paste. The conductive paste has silver particles and a migration inhibitor, which is present in the amount of 12 parts by mass to 40 parts by mass based on 100 parts by mass of the silver particles and represented by Formula (1):