Conductive Paste Step Resistor With Positive-Ion Resin Pathways
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Solution Overview
Problem
Conventional low temperature conductive pastes face limitations in resistance due to the organic binder remaining in the conductive wiring, which is influenced by the drying and curing process, restricting their application.
Innovation Solution
Incorporating positive ions, such as metal cations or hydrogen ions, into the conductive paste system by attaching them to the resin among conductive particles, allowing for improved electron transfer and reducing resistance independent of the drying and curing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If low temperature conductive paste with organic binder is used, then the conductive wiring can be formed on film, sheet or fabric substrates under low temperature conditions, but the resistance of the conductive wiring is limited and depends on the drying and curing process parameters
Solution Approach 1:
The invention changes the chemical composition parameter of the conductive paste by incorporating resin and positive ions (metal cations or hydrogen ions) to replace or supplement the organic binder system. This parameter change enables the conductive paste to achieve low resistance without requiring high temperature curing, thus resolving the contradiction between low curing temperature and reliable electrical resistance
Solution Approach 2:
The invention creates a composite material system consisting of conductive particles, resin, and positive ions. This composite structure combines the benefits of low temperature processing (from the resin matrix) with improved electrical conductivity (from the positive ions), thereby achieving both low curing temperature and reliable electrical resistance simultaneously
2Ease of manufacture
If conventional conductive paste material system is used, then the formulation can be adjusted, but the resistance is still dependent on the temperature and time of drying and curing process
Solution Approach 1:
The invention fundamentally changes the material composition parameters by introducing resin and positive ions into the conductive paste system. This parameter change decouples the resistance control from the drying and curing process parameters (temperature and time), allowing resistance to be primarily controlled by the material formulation itself rather than process conditions, thus improving manufacturing precision while maintaining formulation flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The addition of positive ions enhances conductivity by increasing the number of holes in the conductive structure, significantly reducing resistance, enabling low temperature or zero thermal process formation without altering the conductive paste material system.
Implementation Method 1
the positive ions are attached to the resin among the conductive particles
Implementation Method 2
The electrons can be transferred from the conductive particles to the positive ions and then transferred from the positive ions to adjacent conductive particles
Data Source
AI summary
Provided is an electronic device. The electronic device includes a substrate and a conductive structure disposed on the substrate, the conductive structure includes a conductive pattern made of a conductive paste and positive ions, the conductive pattern includes conductive particles and a resin, and the positive ions are attached to the resin among the conductive particles. The conductive structure is divided into a plurality of areas in a first direction, and a number of the positive ions in adjacent areas of the conductive structure along the first direction is gradually increased or decreased, in such a manner that the conductive structure is a step resistor.