Conductive Paste Composition for Stretch-Stable Printed Wires

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conductive compositions used in wearable devices experience a rapid decrease in electric conductivity during repetitive elongations and shrinkages, leading to potential breakage, which limits their stability and usability.

Innovation Solution

Incorporation of a phenol compound represented by specific general formulae into a conductive paste composition, along with a conductive filler and elastomer resin, enhances the stability of electric conductivity during repetitive elongations and shrinkages, improving printing processability and conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional conductive paste composition is used, then initial electric conductivity can be achieved, but electric conductivity rapidly decreases during repetitive elongations and shrinkages

Engineering Contradiction:
Improvestability of electric conductivityVSAvoidduration of conductivity maintenance
Core Design Contradiction:
ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The patent modifies the chemical composition parameters of the conductive paste by incorporating a specific phenol compound with defined molecular structure (formula 1) containing hydroxyl group, hydrocarbon group, and optional fluorine substitutions. This parameter change in composition stabilizes the conductive network during mechanical deformation, preventing rapid conductivity loss during repetitive elongation and shrinkage cycles

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite conductive paste material combining conductive filler particles with an elastomer binder system that includes the specific phenol compound. This composite structure maintains conductive pathways through the elastomeric matrix during deformation, ensuring stable electric conductivity while providing stretchability and durability for wearable applications

Inventive Principle:
Principle #40Composite materials

2Reliability

If conductive paste composition is optimized for high conductivity, then electric conductivity increases, but printing processability deteriorates

Engineering Contradiction:
Improveelectric conductivityVSAvoidprinting processability
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The phenol compound's molecular parameters (hydroxyl group for bonding, hydrocarbon chain length, fluorine substitution patterns) are optimized to achieve a balance where the composition forms adequate conductive networks for high conductivity while maintaining appropriate viscosity and flow characteristics for good printing processability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The phenol compound provides localized functional groups that facilitate controlled aggregation of conductive fillers to form conductive pathways, while the overall composition maintains homogeneous distribution and appropriate rheological properties for printing. The hydroxyl groups create localized bonding sites without causing excessive aggregation that would harm printability

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12590219B2Phenol compound, conductive paste composition, method for producing conductive paste composition, conductive wire, and method for producing conductive wire
Publication Date: 2026.03.31 SHIN ETSU CHEMICAL CO LTD
  • US12590219B2 patent drawing
  • US12590219B2 patent drawing
  • US12590219B2 patent drawing

AI summary

A phenol compound represented by the following general formula (1A) makes it possible to provide a phenol compound as an additive for a conductive paste composition having a small decrease in electric conductivity in repetitive elongations and shrinkages and excellent printing processability, a conductive paste composition containing the additive, and a conductive wire made by using the conductive paste composition