Conductive Paste Terminal Electrode Multilayer Ceramic Oxidation Resistance
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Solution Overview
Problem
Conductive copper pastes used in multilayer ceramic electronic parts face challenges in binder removal at low oxygen partial pressures, leading to residual carbon issues that affect the reliability and performance of terminal electrodes, particularly in high-temperature stages, where oxidation resistance and dense film formation are critical.
Innovation Solution
A terminal electrode conductive paste comprising a combination of spherical copper powder with a vitreous thin film, flaky copper powder, glass powder, and an aliphatic amine, which enhances oxidation resistance and binder removal characteristics, allowing for dense and conductive film formation even in low-oxygen firing atmospheres.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic vehicle components are increased to improve paste application characteristics, then ease of manufacture is improved, but residual carbon formation increases
Solution Approach 1:
The firing process segments binder removal into a dedicated first stage under oxidizing conditions, ensuring complete decomposition and removal of organic vehicle components before copper sintering begins. This prevents residual carbon formation even with higher organic content paste formulations that improve application characteristics.
2Manufacturing precision
If glass powder is added to improve film fluidization and density, then manufacturing precision is improved, but binder removal difficulty increases due to early glass softening
Solution Approach 1:
The firing process separates binder removal (first stage at 600-800°C) from glass softening and film densification (second stage at 800-1050°C). This ensures complete binder removal occurs before glass softening begins, preventing trapped carbon residues while still achieving dense film formation through subsequent glass fluidization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The paste achieves superior oxidation resistance and binder removal, preventing blistering and deterioration of the ceramic body, ensuring reliable and high-performance terminal electrodes with improved adhesion and conductivity, and reduces the susceptibility to firing conditions, enabling stable production across various ceramic types and firing conditions.
Implementation Method 1
a spherical conductive powder (A) which comprises chiefly copper and has a vitreous thin film on at least a portion of the surfaces thereof
Implementation Method 2
the appropriate combustion, decomposition and removal (also called 'binder removal') of the organic components
Implementation Method 3
in the stage in which the copper powder is sintered at a high temperature
Implementation Method 4
a glass powder (C), wherein the weight ratio of the glass powder (C) to the spherical conductive powder (A) is 0.05 to 5.0
Data Source
AI summary
A conductive paste for a terminal electrode of a multilayer ceramic electronic part, comprising (A) a spherical conductive powder which comprises chiefly copper, and which has a vitreous thin film on at least a portion of the surfaces thereof, (B) a flaky conductive powder comprising chiefly copper, (C) a glass powder, and (D) an organic vehicle, and may further contain (E) an aliphatic amine. When baked to form terminal electrodes for multilayer ceramic electronic parts, this paste exhibits extremely superior binder removal characteristics at low temperatures, and furthermore, it is superior in terms of oxidation resistance, binder removal characteristics and firing characteristics with no need for strict control of the firing conditions, thereby dense terminal electrodes that are superior in terms of adhesion and conductivity can be formed.