Conductive Patches for Hermetic Optoelectronic Packaging

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Solution Overview

Problem

Current packaging technologies for optoelectronic devices, such as OLEDs, face challenges with moisture and oxygen permeation, damage during handling, and the need for cost-effective, flexible, and roll-to-roll producible solutions that ensure reliable electrical interconnections.

Innovation Solution

The use of conductive patches with a conductive metal surface layer and a non-conducting surface layer, applied to feedthrough apertures in a barrier layer, to establish electrical connections between electrodes and an external power source, while maintaining a hermetic seal to prevent moisture and oxygen ingress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If barrier films are used for direct fabrication of OLEDs, then device protection is improved, but the films can be damaged in handling creating moisture ingress paths

Engineering Contradiction:

Improvedevice protectionVSAvoidmoisture ingress

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The barrier film is segmented into multiple discrete barrier layers separated by adhesive layers, allowing each layer to be optimized for specific functions (moisture barrier, mechanical strength, flexibility) while reducing the risk of complete failure from handling damage

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A composite packaging structure is formed by combining multiple materials with different properties: PCTFE barrier layer for moisture protection, PET adhesive layer for mechanical strength and flexibility, and silicone adhesive for sealing. This composite structure provides both protection and damage resistance

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If thin flexible packaging is used for roll-to-roll production, then manufacturing cost and flexibility are improved, but moisture and oxygen can permeate laterally through adhesive layers at edges

Engineering Contradiction:

Improveroll-to-roll productionVSAvoidmoisture and oxygen permeation

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

Thin flexible barrier films and adhesive layers are used to enable roll-to-roll manufacturing while maintaining adequate moisture and oxygen barrier properties through the layered composite structure

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The packaging structure is designed with overlapping edges and sealed perimeters that prevent lateral permeation of moisture and oxygen through adhesive layers before they can reach the device

Inventive Principle:

Principle #10Preliminary action

3Ease of operation

If conductive patches are applied to feedthrough apertures, then electrical interconnections are established, but the package design must maintain hermetic seal

Engineering Contradiction:

Improveelectrical interconnectionVSAvoidhermetic seal

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

Conductive patches serve as intermediary elements that bridge the electrical connection function and the hermetic sealing function. These patches are integrated into the layered packaging structure to provide both electrical conductivity and moisture barrier properties at the feedthrough locations

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS8427845B2Electrical connectors for optoelectronic device packaging

Publication Date: 2013.04.23 BOE TECHNOLOGY GROUP CO LTD

AI summary

Packaged optoelectronic device include a first barrier layer having a plurality of feedthrough apertures communicating with at least one electrode layer of the device, and a plurality of conductive patches disposed on at least one of the plurality of feedthrough apertures for electrically connecting the device to a power supply. Each conductive patch includes a conductive metal surface layer and a non-conducting surface layer having an opening exposing the metal surface layer.