Laser-Sintered Conductive Paths With Precision Ink Ablation
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Solution Overview
Problem
Current methods for producing conductive paths on substrates are inefficient in creating precise and reliable conductive paths, particularly in repairing damaged areas without damaging adjacent components.
Innovation Solution
A method involving the deposition of a layer of conductive ink with metal particles, followed by selective sintering using a patterning laser beam and precise ablation with an ablating laser beam to define conductive paths without damaging surrounding components, utilizing a system with a patterning laser and ablating laser assembly for substrate positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single laser beam is used for both sintering and ablation, then device complexity is reduced, but manufacturing precision deteriorates due to inability to independently control sintering and ablation parameters
Solution Approach 1:
The patent divides the laser processing function into two separate laser beams: a first laser beam for sintering metal particles and a second laser beam for ablation of non-conductive material. This segmentation allows independent optimization of each laser's parameters (power, pulse duration, wavelength) to achieve precise control over sintering and ablation processes, resolving the contradiction between device simplicity and manufacturing precision.
Solution Approach 2:
The patent applies different laser parameters to different spatial regions: the first laser beam uses parameters optimized for sintering metal particles (higher power, longer pulse duration) while the second laser beam uses parameters optimized for ablation (lower power, shorter pulse duration). This local quality approach enables precise control of each process at its specific location, achieving high manufacturing precision without requiring complex multi-laser systems.
2Productivity
If high power laser is used for ablation, then ablation efficiency is improved, but sintered regions are damaged due to unintended ablation
Solution Approach 1:
The patent employs periodic pulsed laser action with carefully controlled pulse durations and intervals. The first laser beam sinters metal particles using longer pulses, followed by shorter pulses from the second laser beam for ablation. This periodic action with varying pulse characteristics enables efficient ablation while preventing thermal accumulation that would damage sintered regions, thus maintaining both productivity and reliability.
Solution Approach 2:
The patent changes laser parameters (power level, pulse duration, wavelength, scan speed) between the two laser beams to achieve different effects. The second laser beam operates at lower power levels and shorter pulse durations compared to the first laser beam, enabling precise ablation of non-conductive material without transferring enough energy to damage the already-sintered metal conductors, thereby resolving the contradiction between ablation efficiency and conductor integrity.
3Loss of time
If conventional laser sintering is used without subsequent ablation, then processing time is reduced, but conductive path edge definition deteriorates
Solution Approach 1:
The patent performs preliminary sintering with the first laser beam to create conductive paths, then follows with a second laser beam for precise ablation to define edges. This preliminary action approach ensures that the conductive material is already in place before edge definition, allowing the ablation step to focus solely on removing non-conductive material for precise edge definition without requiring additional material deposition time, thus balancing processing time with manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of precise conductive paths with high edge definition accuracy and uniformity, effectively repairing conductive paths without damaging adjacent circuit elements, even when components are close together, and allows for the removal of unsintered ink without harming the conductive paths.
Implementation Method 1
employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions
Implementation Method 2
employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions
Data Source
AI summary
A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.