Conductive Pathways Wrapping Semiconductor Device Sides
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Solution Overview
Problem
Existing semiconductor device assemblies face challenges in maximizing circuit density and flexibility while maintaining effective electrical communication between stacked semiconductor dice and a substrate, with conventional methods often resulting in increased complexity and reduced reliability.
Innovation Solution
The use of self-supporting conductive leads or conductive traces that extend around the sides of semiconductor devices, allowing for electrical communication between dice and a substrate, with ends positioned on major surfaces for structural and electrical coupling, enhancing flexibility and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive paths are formed on or within a substrate to provide electrical communication between stacked semiconductor dice and substrate, then electrical connectivity is achieved, but device complexity and parasitic capacitance increase
Solution Approach 1:
The conductive leads extend in three dimensions around the sides of semiconductor dice rather than being confined to two-dimensional substrate planes. This spatial reconfiguration allows electrical communication between stacked dice and substrate while reducing parasitic capacitance and simplifying the overall conductive path structure.
Solution Approach 2:
The conductive leads are extracted from the substrate and made self-supporting, eliminating the need for complex substrate-integrated conductive paths. This separation reduces device complexity while maintaining reliable electrical communication between stacked semiconductor devices.
2Reliability
If self-supporting conductive leads extend around the sides of semiconductor devices, then parasitic capacitance is reduced and reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The self-supporting conductive leads are pre-formed and prepared before assembly with the semiconductor dice. This preliminary preparation simplifies the final assembly process, allowing the leads to be easily positioned and attached around the sides of the stacked devices without requiring complex in-situ formation procedures.
3Temperature
If conductive pathways are configured to extend around sides of semiconductor devices, then heat dissipation is improved acting as heat sink, but structural complexity increases
Solution Approach 1:
The self-supporting conductive leads serve multiple functions simultaneously: providing electrical communication between stacked semiconductor dice and substrate, reducing parasitic capacitance, and acting as heat sinks for thermal management. This multi-functionality reduces overall device complexity while achieving multiple performance goals.
Solution Approach 2:
The conductive leads are configured with specific physical parameters (length, cross-section, material properties) that optimize their heat dissipation capability. By adjusting these parameters, the leads effectively function as heat sinks without requiring additional thermal management structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient electrical communication, improved reliability, and reduced parasitic capacitance, while also acting as a heat sink, thereby enhancing performance and product life in stacked semiconductor device assemblies.
Implementation Method 1
electrically conductive paths that provide electrical communication between semiconductor dice in such semiconductor device assemblies and conductive structures of a substrate
Implementation Method 2
acting as a heat sink, thereby enhancing performance and product life in stacked semiconductor device assemblies
Data Source
AI summary
Semiconductor device assemblies and systems that include at least one semiconductor device assembly include two or more semiconductor devices stacked one over another. Conductive pathways that extend around at least one side of at least one of the semiconductor devices provide electrical communication between conductive elements of the semiconductor devices, and optionally, a substrate. The conductive pathways may include self-supporting conductive leads or conductive traces carried by a substrate. Methods for forming semiconductor device assemblies having more than one semiconductor device include bending or wrapping at least one conductive pathway around a side of at least one semiconductor device and providing electrical communication between semiconductor devices of the assembly through the conductive pathways.