Conductive Pattern Composition Resolving Adhesion and Flame Retardancy
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for forming conductive patterns on polymeric resin substrates are complex and fail to achieve excellent adhesion strength and flame retardancy, particularly for applications like mobile devices and RFID tags.
Innovation Solution
A composition comprising a non-conductive metal compound with a specific three-dimensional crystal structure, combined with a polymer resin and a flame retardant, is irradiated with electromagnetic waves to form a conductive pattern, enabling efficient and simplified formation of fine conductive patterns with excellent adhesion and flame retardancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods (metal layer formation with photolithography or conductive paste printing) are used to form conductive patterns, then conductive patterns can be formed on polymeric resin substrates, but the process becomes too complicated and equipment requirements increase
Solution Approach 1:
The invention extracts and eliminates the complex photolithography and metal layer formation steps from the conventional process. By incorporating metal compounds directly into the resin substrate and using selective laser irradiation to activate only the desired pattern areas, the method removes unnecessary process steps and equipment requirements while achieving the same conductive pattern formation goal
Solution Approach 2:
The invention replaces the mechanical/chemical photolithography process with optical laser irradiation. Instead of using photolithography masks, chemicals, and multiple processing steps, the method uses laser light to selectively activate metal compounds embedded in the resin, substituting a complex mechanical-chemical system with a simpler optical system
2Manufacturing precision
If conventional methods are used to form conductive patterns, then conductive patterns can be created, but it is difficult to form excellent fine conductive patterns with good adhesion strength
Solution Approach 1:
The invention applies local quality by embedding metal compounds uniformly throughout the resin substrate and then using selective laser irradiation to activate only the specific areas where conductive patterns are needed. This localized activation ensures precise pattern formation with excellent adhesion strength at the exact locations required, while maintaining the integrity of the surrounding areas
Solution Approach 2:
The invention performs preliminary action by pre-incorporating metal compounds (such as copper, silver, or aluminum compounds) into the resin substrate during manufacturing, before the actual pattern formation step. This pre-positioning of metal compounds ensures that when laser irradiation occurs, the metal is already in place to form adherent conductive patterns, eliminating the need for subsequent metal deposition steps that would compromise adhesion
3Adaptability or versatility
If conductive patterns are formed on polymeric resin substrates for electronic device applications, then functional conductive patterns can be created, but flame retardancy requirements may not be met
Solution Approach 1:
The invention uses composite materials by combining polymer resin with metal compounds (such as copper compounds, silver compounds, or aluminum compounds) and flame retardant additives within the same substrate. This composite structure allows the material to simultaneously achieve electrical conductivity where needed, flame retardancy for safety compliance, and mechanical integrity, making it suitable for electronic device applications without compromising any single property
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the effective formation of fine conductive patterns with strong adhesion and enhanced flame retardancy, suitable for applications in electronic devices and sensors, while maintaining the physical properties of the resin substrate.
Implementation Method 1
a metal nucleus including the first metal element, the second metal element or an ion thereof is formed from the non-conductive metal compound by the electromagnetic irradiation
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern on a variety of polymeric resin products or resin layers by a simplified process, while imparting excellent flame retardancy to the resin products or resin layers, and a resin structure having the conductive pattern obtained using the composition. The composition for forming a conductive pattern includes: a polymer resin; a non-conductive metal compound including a first metal element and a second metal element, having a R3m or P63/mmc space group in crystal structure; and a flame retardant, wherein a metal nucleus including the first metal element, the second metal element or an ion thereof is formed from the non-conductive metal compound by the electromagnetic irradiation.