Conductive Pattern Composition via Electromagnetic Activation
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Solution Overview
Problem
Current methods for forming conductive patterns on polymer resin substrates are complex and inefficient, making it difficult to achieve fine conductive patterns effectively.
Innovation Solution
A composition comprising a polymer resin and a non-conductive metal compound (Chemical Formula A3-xB3+xC8) is used, where electromagnetic irradiation forms a metal core, which is then chemically reduced to create a conductive metal layer, allowing for the formation of fine conductive patterns on polymer resin products or layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods (photolithography or conductive paste printing) are used to form conductive patterns, then conductive patterns can be formed on polymer resin substrates, but the process becomes too complicated and it is difficult to form excellent fine conductive patterns
Solution Approach 1:
The invention extracts and utilizes only the necessary functional components (metal compounds with specific electron configurations) from complex conventional processes. By incorporating metal compounds directly into the polymer resin composition, the method eliminates the need for separate metal layer formation and photolithography steps, achieving fine conductive patterns through a simplified process where the metal compounds are selectively activated or transformed in desired pattern areas.
Solution Approach 2:
The metal compounds incorporated into the polymer resin serve multiple functions: they act as both the conductive material source and the pattern definition material. The same composition that forms the substrate also contains the precursors for conductive patterns, eliminating the need for separate conductive paste application and reducing process complexity while enabling fine pattern formation.
2Reliability
If conventional methods are used to form conductive patterns, then conductive patterns can be created, but material usage is inefficient and adhesion is insufficient
Solution Approach 1:
The invention merges the substrate material and conductive material into a single integrated composition. The metal compounds are incorporated within the polymer resin matrix, creating a unified structure where the conductive pattern and substrate are chemically and physically integrated. This merging ensures excellent adhesion between the conductive pattern and substrate, as they are essentially part of the same material system, while eliminating material waste from separate application processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the simple and effective formation of fine conductive patterns on polymer resin substrates, suitable for applications like antennas, RFID tags, and sensors, with excellent adhesion and reduced material usage.
Implementation Method 1
a non-conductive metal compound of Chemical Formula 1 including a first metal and a second metal, wherein a metal core including the first or second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation
Data Source
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AI summary
The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern on a variety of polymer resin products or resin layers by a significantly simple process, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern includes: a polymer resin; and a non-conductive metal compound including at least one of first and second metals as a predetermined non-conductive metal compound including the first and second metals, wherein a metal core including the first or second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.