Conductive Pattern Edge Refinement With Etching and Short-Pulse Laser
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing conductor patterns, such as those used in encoders, face challenges in forming edges with high accuracy while keeping manufacturing costs low, as etching techniques result in edge taper and roughness, and short-pulse laser processing increases costs due to prolonged processing times and energy conversion to heat.
Innovation Solution
A manufacturing method involving a substrate with a conductor layer, where a short-pulse laser is used to refine edges after initial etching, reducing edge roughness to 1 µm or less and minimizing processing time, thereby reducing costs and improving precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If etching technique is used to form conductor pattern, then manufacturing cost is reduced, but edge accuracy deteriorates due to edge taper and roughness
Solution Approach 1:
The manufacturing process is divided into two distinct stages: first, etching is used to remove the majority of the conductor material efficiently, and second, a short-pulse laser is applied only to the edge regions that require high-precision refinement. This segmentation allows each method to be optimized for its specific function, combining the cost-effectiveness of etching with the precision of laser processing.
Solution Approach 2:
The etching process is performed as a preliminary action to remove the bulk of the conductor material before the final laser refinement step. This preliminary removal of excess material reduces the workload and processing time for the subsequent high-precision laser edge formation, making the overall process more efficient and cost-effective.
2Manufacturing precision
If short-pulse laser is used for entire conductor pattern processing, then edge accuracy is improved, but manufacturing cost increases due to prolonged processing time
Solution Approach 1:
The processing area is segmented into two zones: the main body of the conductor pattern is handled by rapid etching, while only the critical edge regions are processed by the short-pulse laser. This spatial segmentation ensures that the expensive and time-consuming laser processing is applied only where high precision is necessary, rather than across the entire pattern.
Solution Approach 2:
Instead of applying the high-precision short-pulse laser to the entire conductor pattern (excessive action), the laser is applied only to the specific edge regions that require precision (partial action). This partial application of the premium processing method achieves the necessary edge accuracy without the prohibitive time and cost costs of processing the entire pattern with the laser.
3Manufacturing precision
If short-pulse laser is used for entire conductor pattern processing, then edge accuracy is improved, but heat-related damage increases
Solution Approach 1:
The conductor pattern is segmented into a bulk region and an edge region. The bulk region is processed by etching, which generates minimal heat, while the edge region is processed by the short-pulse laser. This segmentation limits the exposure of the conductor material to laser-induced heat, reducing thermal damage, melting, and vaporization that would occur if the entire pattern were processed by the laser.
Solution Approach 2:
The harmful thermal effects are extracted or removed from the main processing body by using etching instead of laser processing for the bulk conductor material. Only the essential edge regions are subjected to laser processing, thereby extracting and isolating the heat generation to minimal areas where it is necessary for achieving precision edges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high-precision edge formation with reduced manufacturing costs by using a short-pulse laser to refine edges after initial etching, enhancing measurement accuracy and productivity while minimizing heat-related damage.
Implementation Method 1
forming an outline of the conductor pattern on the conductor with a short-pulse laser
Implementation Method 2
removing at least a part of the conductor other than the conductor pattern by etching
Data Source
AI summary
A manufacturing method of a conductor pattern includes, preparing a substrate provided with a conductor on one main surface thereof, forming an outline of the conductor pattern on the conductor with a short-pulse laser, and removing at least a part of the conductor other than the conductor pattern by etching.