Conductive Pattern Formation via Two-Step Exposure
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Solution Overview
Problem
Existing methods for forming conductive patterns in liquid crystal display devices and touch panels face challenges such as high surface resistance, adhesion issues, and significant step differences, which affect the smoothness and visibility of the patterns, leading to potential air bubble entrapment and reduced product quality.
Innovation Solution
A conductive pattern formation method involving a two-step exposure process with active light, first on a photosensitive layer with a conductive film and then in the presence of oxygen, followed by development, to create a conductive pattern with a reduced step difference and improved adhesion to the substrate, using a photosensitive conductive film with a support film, conductive film, and photosensitive resin layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a transparent conductive film is patterned using conventional sputtering and wet etching methods, then conductive patterns can be formed, but the process time increases and manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates the sputtering step by directly forming the transparent conductive film through solution processing methods. The conductive film is deposited from a solution containing conductive particles or precursors, bypassing the time-consuming vacuum sputtering process while achieving comparable or superior film quality and pattern definition.
Solution Approach 2:
The patent replaces the mechanical/physical sputtering process with chemical solution processing. Instead of using plasma and physical deposition, the conductive film is formed through chemical reactions, dissolution, or precipitation from solution, significantly reducing process time and equipment complexity.
2Manufacturing precision
If a transparent conductive film is patterned using sputtering and wet etching, then conductive patterns are formed, but the manufacturing cost increases
Solution Approach 1:
The patent employs inexpensive solution processing methods that can be performed with simple equipment and materials. The conductive film is formed using affordable precursors, solvents, and processing techniques that eliminate the need for expensive vacuum sputtering equipment, thereby reducing manufacturing costs while maintaining pattern quality.
Solution Approach 2:
The patent replaces costly vacuum sputtering equipment and processes with simple solution processing methods that can be performed in standard laboratory or manufacturing environments. This substitution dramatically reduces equipment investment and operational costs while achieving comparable or better pattern definition.
3Reliability
If the conductive film thickness is increased to reduce surface resistance, then conductivity improves, but the step difference increases and visibility increases
Solution Approach 1:
The patent changes the material parameters by using highly conductive materials or composite structures that achieve low surface resistance at reduced thickness. By altering the conductive mechanism or material composition, the film can provide sufficient conductivity with minimal thickness, thereby reducing step differences and visibility.
Solution Approach 2:
The patent employs composite conductive films combining conductive particles, fibers, or nanomaterials with transparent matrices. These composite structures provide enhanced conductivity per unit thickness, allowing thin films to achieve low surface resistance without increasing step differences or visibility.
4Reliability
If the conductive film thickness is increased to reduce surface resistance, then conductivity improves, but the pattern visibility increases
Solution Approach 1:
The patent optimizes the optical and electrical parameters by selecting materials with high electrical conductivity and high optical transparency. By changing material composition or structure, the film achieves low surface resistance while maintaining optical clarity, thereby reducing pattern visibility.
Solution Approach 2:
The patent uses composite materials that combine conductive elements with transparent matrices optimized for optical clarity. These composites provide high conductivity at low thickness while maintaining excellent transparency, reducing pattern visibility compared to conventional thick metal films.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a conductive pattern with reduced step difference, enhanced adhesion, and improved smoothness, reducing the visibility of the pattern and the likelihood of air bubbles, resulting in a more aesthetically pleasing and functional touch panel sensor.
Implementation Method 1
a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate
Implementation Method 2
a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step
Data Source
AI summary
A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.