Conductive Pattern Formation Using Gas Bubble Self-Assembly
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Solution Overview
Problem
Conventional methods for forming conductive patterns on substrates, such as photolithography and etching, are complex and costly, and alternative methods like screen printing and inkjet techniques face challenges in achieving fine patterns and adhesion issues.
Innovation Solution
A method involving a flat plate with a convex pattern and a fluid containing conductive particles and a gas bubble generating agent, where gas bubbles are generated by heating to self-assemble the conductive particles into a desired pattern on the substrate, allowing for simple and cost-effective formation of fine conductive patterns through interfacial forces and subsequent curing or bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If screen printing method is used to form conductive pattern, then the process is simpler and cost is lower, but fine pattern formation is difficult
Solution Approach 1:
A transparent plate with convex patterns serves as an intermediary mold to guide the self-assembly of conductive particles. The convex patterns on the plate create corresponding cavities in the cured resin layer, which then guide conductive particles to self-assemble into fine patterns through capillary action and interfacial forces, resolving the contradiction between simple processing and fine pattern formation
Solution Approach 2:
Conductive particles self-assemble into desired patterns automatically through interfacial forces and capillary action without requiring complex photolithography or etching processes. The particles naturally migrate and organize themselves within the resin cavities, achieving fine pattern formation through self-service mechanisms
2Ease of manufacture
If inkjet method is used to form conductive pattern, then the process is simpler, but adhesion between conductive paste and substrate is poor
Solution Approach 1:
A transparent plate with convex patterns acts as an intermediary mold that creates cavities in the resin layer. These cavities confine conductive particles and enhance their adhesion to the substrate through the mold's geometric constraints and interfacial forces, solving the adhesion problem while maintaining process simplicity
Solution Approach 2:
The invention changes the physical state and distribution parameters of conductive particles by confining them within resin cavities created by the convex mold. This spatial confinement and the associated interfacial forces significantly improve adhesion between conductive particles and substrate compared to conventional inkjet methods
3Manufacturing precision
If photolithography and etching are used to form conductive pattern, then manufacturing precision is high, but device complexity and cost increase
Solution Approach 1:
The invention extracts and eliminates the complex photolithography and etching processes from the conductive pattern formation workflow. By using a simple convex mold and self-assembly mechanism, it achieves comparable or superior pattern precision without the need for sophisticated optical systems, photoresists, and etching equipment
Solution Approach 2:
The convex patterns on the transparent plate serve as a physical copy or template of the desired conductive pattern. This simple geometric copy reproduces the target pattern through direct contact and self-assembly, replacing the complex multi-step photolithography copying process with a single-step mold-based replication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of conductive patterns in a simple and cost-effective manner with improved adhesion and fine shape retention, using self-assembly and bonding techniques to create stable and reliable conductive structures.
Implementation Method 1
generating gas bubbles from the gas bubble generating agent contained in the fluid body by heating the fluid body
Implementation Method 2
generating gas bubbles from the gas bubble generating agent contained in the fluid body by heating the fluid body
Implementation Method 3
the fluid body is forced out of the gas bubbles generated from the gas bubble generating agent as the gas bubbles grow and self-assembles between the convex pattern formed on the flat plate and the substrate
Implementation Method 4
the fluid body is forced out of the gas bubbles generated from the gas bubble generating agent as the gas bubbles grow and self-assembles between the convex pattern formed on the flat plate and the substrate owing to interfacial force
Implementation Method 5
the third step includes a sub-step of heating the fluid body at a temperature at which the conductive particles are melted after allowing the fluid body to self-assemble between the convex pattern and the substrate, and the conductive particles are bonded to one another through metallic bond in the sub-step of heating
Implementation Method 6
the conductive particles are bonded to one another through metallic bond in the sub-step of heating
Implementation Method 7
the resin is a light setting resin and the resin having self-assembled between the convex pattern and the substrate is cured with light by selectively irradiating the resin with light in the third step
Data Source
AI summary
[Problem] To provide a conductive pattern formation method in which a fine pattern can be formed in a simple way at low cost.[Means for Solving Problem] A flat plate having a convex pattern on its surface is provided so as to oppose a substrate, a fluid body including conductive particles and a gas bubble generating agent is supplied into a gap between the substrate and the flat plate, and thereafter, the fluid body is heated for generating gas bubbles from the gas bubble generating agent included in the fluid body. The fluid body is forced out of the gas bubbles as the gas bubbles generated from the gas bubble generating agent grow, so as to self-assemble between the convex pattern formed on the flat plate and the substrate owing to interfacial force, and an aggregate of the conductive particles included in the fluid body having self-assembled is made into a conductive pattern formed on the substrate.