Conductive Pattern Printing via Melt Pressing and Cold Nip Solidification
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Solution Overview
Problem
Existing methods for producing conductive patterns in printed electronics face challenges in achieving good adhesion, high peeling strength, continuity of conductivity, applicability of different conductive compounds, and production speed, particularly due to the use of costly fine-grained metal powders and limitations in roll materials and processes.
Innovation Solution
Heating conductive particles above their melting point and then pressing them in a cold nip, where the surface temperature is maintained at least 60 degrees Celsius below the melting point, to create solidified conductive patches with good adhesion and continuity on various substrates such as paper, polymer films, and textiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If fine-grained metal powder is used to ensure continuity of conductivity, then manufacturing precision of conductive patterns is improved, but material cost increases and production speed decreases
Solution Approach 1:
The invention changes the physical state parameter of conductive particles from solid to liquid by heating above melting point, enabling larger particles to be used while maintaining continuity through controlled spreading and coalescing of the liquid phase
Solution Approach 2:
The conductive particles undergo phase transition from solid to liquid during heating, allowing them to flow and merge into continuous conductive paths. This phase change enables the use of larger particles that can be applied more quickly while still achieving continuous conductivity patterns
2Strength
If heating temperature is increased above melting point to improve adhesion and peeling strength, then bond strength is improved, but energy consumption increases
Solution Approach 1:
The process utilizes the phase transition from solid to liquid at the melting point to achieve strong adhesion. The liquid phase allows the conductive material to wet and bond effectively to the substrate, and subsequent controlled cooling creates strong mechanical interlocking without requiring excessive temperature increases
Solution Approach 2:
Heating is applied locally to the conductive particles and their immediate substrate area rather than uniformly across the entire substrate. This localized heating approach achieves the necessary bonding temperature only where needed, significantly reducing overall energy consumption while maintaining high peeling strength at the conductive pattern locations
3Quantity of substance
If larger conductive particles are used to reduce material cost, then material cost decreases, but continuity of conductivity becomes difficult to achieve
Solution Approach 1:
By changing the temperature parameter above the melting point, the invention transforms discrete solid particles into a liquid state that can flow and coalesce. This allows larger, more cost-effective particles to form continuous conductive paths through controlled spreading and merging in the liquid phase, followed by solidification
Solution Approach 2:
The phase transition from solid to liquid enables larger particles to be used while achieving continuity. In the liquid state, surface tension and capillary forces cause the molten particles to spread and merge into continuous patterns, which then solidify upon cooling to maintain electrical continuity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures high peeling strength and continuity of conductivity while reducing material costs by using larger conductive particles, enhancing production efficiency, and allowing for diverse substrate materials and conductive compounds, thereby improving the overall process of printed electronics.
Implementation Method 1
heating the electrically conductive solid particles to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt
Implementation Method 2
pressing them against the substrate in a cold nip
Implementation Method 3
the surface temperature of the portion of the nip that comes against the melt is lower than said characteristic melting point
Data Source
Figure 1~4
Figure 5~12
AI summary
A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.