Conductive Pattern Stacking for Magnetic Self-Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In large-area, thin, and composite material products, non-linearity due to warpage and thermal deformation during assembly processes decreases precision, making precise alignment challenging in packaging and board assembly.
Innovation Solution
A stacked structure utilizing conductor patterns on substrates and semiconductor chips that align through magnetic force, eliminating the need for separate optical measurement and preventing warpage or nonlinear deformation by generating a magnetic field when current is applied, allowing self-alignment of chips and substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If optical measurement and motor control are used to align devices during assembly, then alignment precision can be maintained in standard products, but non-linearity occurs due to warpage and thermal deformation in large-area thin composite products, decreasing precision
Solution Approach 1:
The patent replaces the mechanical/optical alignment system (fiducial marker measurement and motor control) with a magnetic field-based self-alignment system. Conductor patterns generate magnetic fields that automatically align semiconductor chips with substrates without requiring optical measurement, eliminating the problem of non-linear deformation affecting precision.
Solution Approach 2:
The patent implements self-alignment through magnetic fields generated by conductor patterns on both the substrate and semiconductor chip. The components automatically align themselves during the assembly process without external measurement or control systems, making the alignment process self-correcting and immune to warpage and thermal deformation issues.
2Manufacturing precision
If fiducial marker measurement and motor control are implemented for device mounting, then positioning accuracy is achieved, but the process complexity increases and additional measurement steps are required
Solution Approach 1:
The patent eliminates the complex optical measurement and motor control system by replacing it with a passive magnetic field interaction system. Conductor patterns on the substrate and chip generate magnetic fields that naturally guide alignment, removing the need for fiducial markers, measurement devices, and active motor control mechanisms.
Solution Approach 2:
The alignment function is built into the conductor patterns themselves, which generate magnetic fields that automatically perform the alignment task. This self-service mechanism eliminates the need for separate measurement and control systems, simplifying the overall assembly process while maintaining positioning accuracy.
3Productivity
If conventional assembly processes are used for large-area products, then manufacturing flow is maintained, but warpage and thermal deformation cause non-linearity, decreasing assembly precision
Solution Approach 1:
The patent replaces the conventional mechanical assembly process with a magnetic field-based self-alignment process. This substitution allows large-area thin composite products to self-align during assembly, preventing warpage and thermal deformation from affecting precision while maintaining manufacturing flow.
Solution Approach 2:
The conductor patterns enable the components to self-align automatically during the assembly process, compensating for warpage and thermal deformation in real-time. This self-correcting mechanism maintains high assembly precision for large-area products without disrupting the manufacturing flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise self-alignment of semiconductor chips and substrates without additional measurement steps, maintaining alignment accuracy even in large-area, thin, and composite products, thereby improving assembly precision and reducing errors.
Implementation Method 1
generating a magnetic field when current is applied
Data Source
AI summary
A stacked structure includes a lower substrate and a first semiconductor chip stacked on an upper surface of the lower substrate, the lower substrate includes a lower conductor pattern disposed on the upper surface of the lower substrate, the first semiconductor chip may have first and second surfaces facing each other, the second surface of the first semiconductor chip may face the upper surface of the lower substrate, and the first semiconductor chip may include a first conductor pattern disposed on the second surface. The first conductor pattern may be aligned with the lower conductor pattern in a first direction perpendicular to the upper surface of the lower substrate, and the first conductor pattern may be spaced apart from the lower conductor pattern in the first direction.