Self-Propelled Conductive Pattern Transfer Apparatus
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Solution Overview
Problem
Existing digital printing techniques for conductive traces suffer from low conductivity due to incomplete volume distribution of metallic particles, leading to significant voltage drops and ohmic losses, making it challenging to print large conductive patterns efficiently.
Innovation Solution
A self-propelled pattern transferring apparatus with modules for digital electronic printing, incorporating a solid-state laser for sintering and UV light for curing, which uses Joule heating and mechanical pressure to enhance sintering efficiency and reduce surface scattering effects, allowing for scalable and economic printing of conductive traces on various substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If digital printing is used to transfer conductive patterns, then manufacturing flexibility and adaptability are improved, but the conductivity of the printed traces deteriorates due to incomplete particle distribution
Solution Approach 1:
The patent applies preliminary action by performing multiple passes of ink deposition before sintering. The conductive ink is printed repeatedly over the same trace path, with each pass adding more metallic particles to ensure complete coverage and optimal distribution. Only after these preliminary printing passes are completed is the sintering process initiated, allowing the accumulated particles to form highly conductive traces.
2Ease of manufacture
If standard sintering processes are used on printed traces, then manufacturing simplicity is maintained, but conductivity deteriorates due to surface scattering effects and incomplete particle consolidation
Solution Approach 1:
The patent merges multiple functions into a single integrated sintering head that combines a laser source, UV LED array, and mechanical pressure application system. This unified device simultaneously performs laser heating, UV curing of binders, and applies mechanical pressure to consolidate particles, achieving superior conductivity without requiring separate processing steps or equipment.
Solution Approach 2:
The patent applies parameter changes by dynamically controlling the laser power, UV LED intensity, and mechanical pressure during the sintering process. The system adjusts these parameters based on the specific trace geometry, ink composition, and substrate properties to optimize particle consolidation and minimize surface scattering effects, thereby maximizing conductivity.
3Manufacturing precision
If multiple printing passes are performed to improve conductivity, then manufacturing precision is improved, but production time increases
Solution Approach 1:
The patent implements continuity of useful action by performing multiple printing passes without moving the substrate or repositioning the printhead between passes. The printhead remains in continuous operation, depositing ink in rapid succession along the same trace path, thereby maintaining production speed while ensuring optimal particle distribution for high conductivity.
4Use of energy by moving object
If laser sintering is used to improve conductivity, then energy efficiency is improved, but device complexity increases due to integration of laser and UV modules
Solution Approach 1:
The patent applies universality by designing a multi-functional sintering head that performs laser heating, UV curing, and mechanical pressure application using a single integrated device. This universal toolhead can process different trace types and ink formulations with a single configuration, reducing the need for multiple specialized equipment and simplifying the overall manufacturing system despite the advanced capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves high conductivity comparable to standard wires, enabling efficient and economic printing of large conductive patterns on diverse substrates, including flexible and rigid materials, with reduced production time and energy dispersion.
Implementation Method 1
at least a module to perform a post-treatment, in particular sintering, of the transferred pattern
Implementation Method 2
an optical module to perform a sintering of the transferred pattern
Implementation Method 3
an optical module to perform the curing of the protection
Implementation Method 4
which uses Joule heating and mechanical pressure to enhance sintering efficiency
Data Source
AI summary
Apparatus for transferring conductive patterns to a substrate (56), comprising a module (52) configured to transfer a pattern (63) of sinterable material (63a) to said substrate (56) and an optical module (12) to perform a sintering of the transferred pattern (63a). Said apparatus comprises one or more self-propelled pattern transferring units (52) comprising a module configured to move said self-propelled unit (14, 20) over said substrate (56) under the control of movement instructions (53b) associated to a motor (16, 21), said self-propelled unit (14, 20) comprising said module (52) configured to transfer a pattern (63a) of sinterable material (CI) to said substrate (56) obtaining a transferred pattern (63a) and comprising also said optical module (12) to perform a sintering of the transferred pattern (63a) on said substrate (56) obtaining a sintered pattern (63b, 63c).