Conductive Patterns Using Solid Supports for Inkjet Printing
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Solution Overview
Problem
Current methods for producing narrow and thin conductors in small electronic devices lack the precision needed, often resulting in poor conductivity due to ink spreading and the addition of rheology modifiers, which can impede the sintering process of metallic nanoparticle inks.
Innovation Solution
A method involving the use of high-aspect ratio conductive patterns created by disposing conductive materials between solid supports on a substrate and removing the supports to achieve precise geometry, using capped metal particles and controlled inkjet printing to produce conductive lines with desired thickness and width, while avoiding the use of rheology modifiers that degrade conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional methods are used to produce narrow conductors, then the footprint of electronic devices can be reduced, but the precision and conductivity of the conductors deteriorate due to ink spreading
Solution Approach 1:
The patent introduces a carrier liquid as an intermediary medium to precisely control the deposition of conductive material. The carrier liquid enables the conductive material to be deposited in a controlled manner without spreading, achieving narrow conductor widths (e.g., 50 microns or less) while maintaining manufacturing precision. The carrier liquid is subsequently removed, leaving the precise conductive pattern.
Solution Approach 2:
The patent changes the physical state and properties of the conductive material by using it in a liquid carrier form during deposition, then removing the carrier to leave the solid conductive pattern. This parameter change allows for precise dimensional control during the liquid phase deposition and achieves the desired narrow geometry after carrier removal.
2Manufacturing precision
If rheology modifiers are added to prevent ink spreading, then conductor geometry can be controlled, but conductivity deteriorates due to impeded sintering process
Solution Approach 1:
The carrier liquid serves as a temporary intermediary that provides geometric control during deposition but is completely removed before the sintering process. This eliminates the need for rheology modifiers that would otherwise remain in the conductor and impede sintering. The carrier liquid fulfills the geometric control function temporarily, then is discarded.
Solution Approach 2:
The patent extracts and removes the carrier liquid from the conductive material after deposition but before sintering. This extraction eliminates any potential interference with the sintering process while having already achieved the desired geometric control. The carrier liquid is taken out completely, leaving no residue to impede conductivity.
3Manufacturing precision
If solid supports are used to define spacing for conductive patterns, then manufacturing precision can be improved, but device complexity increases
Solution Approach 1:
The solid supports are placed in advance on the substrate to define the desired spacing and geometry of the conductive pattern before the conductive material is deposited. This preliminary action establishes the precise geometric framework that guides the subsequent deposition process, ensuring manufacturing precision without requiring complex real-time control mechanisms.
Solution Approach 2:
The solid supports act as a physical template or copy of the desired conductive pattern geometry. By placing supports at the exact positions and orientations needed, the final conductive pattern is a direct copy of the support arrangement. This simplifies the manufacturing process by using a straightforward template-based approach rather than complex direct deposition control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of conductive patterns with high aspect ratios, achieving conductivity closer to that of bulk metal, with precise control over dimensions and preventing ink spreading, thus enhancing the performance of electronic devices.
Implementation Method 1
using capped metal particles and inkjet printing technology to produce conductive lines with controlled dimensions and high conductivity
Implementation Method 2
The solid support may be removed by thermal treatment, chemical treatment or other methods that may remove the solid support without damage to the conductive pattern
Implementation Method 3
The solid support may be removed by thermal treatment, chemical treatment or other methods that may remove the solid support without damage to the conductive pattern
Implementation Method 4
overcoming the limitations of existing technologies by preventing ink spreading and maintaining the integrity of the sintering process
Data Source
AI summary
Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.