Resilient Conductive Pillar Array for High-Density Chip Testing
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Solution Overview
Problem
Current probe cards are inadequate for testing high-density integrated circuits and micro LED arrays due to limitations in miniaturization of test pins, leading to inefficiencies in defect detection and sorting, especially in high-density display technologies where unevenness and defects are difficult to identify before transferring to TFT substrates.
Innovation Solution
An electronic detection interface with a substrate structure featuring an array of detection units, each including resilient conductive pillars that can be compressed to electrically connect with micro semiconductor or photoelectric chips, allowing for array or row-by-row detection, coupled with image detecting units to capture and analyze parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional probe cards with test pins are used for high-density integrated circuits, then the testing capability is limited by the miniaturization obstacles of test pins, but the device complexity and testing efficiency are insufficient
Solution Approach 1:
The patent replaces the traditional mechanical probe card system with a completely different approach: using a display device itself as the detection interface. The display pixels serve as both the product being tested and the detection elements, eliminating the need for separate mechanical test pins. This substitution resolves the miniaturization limitations by using the inherent structure of the display technology rather than attempting to further reduce mechanical probe dimensions.
Solution Approach 2:
The patent makes the display device multi-functional by using its pixels to perform both their primary function (display) and a secondary function (detection). The same display structure that presents visual information also detects electrical properties of integrated circuits, eliminating the need for separate testing equipment and improving productivity without increasing device complexity.
2Ease of manufacture
If detection is performed after transferring μLED array to TFT substrate, then the detection process is simplified, but defect identification becomes difficult and visual uniformity is compromised
Solution Approach 1:
The patent performs detection before the μLED array is transferred to the TFT substrate. By detecting electrical properties at an earlier stage in the manufacturing process, the system identifies defects in individual μLEDs before they are assembled into the final display. This preliminary detection allows for precise defect identification and sorting, ensuring high manufacturing precision while maintaining ease of manufacture through the use of the display's own pixels as detectors.
3Ease of operation
If traditional probe cards test chips one by one, then the testing process is simple to implement, but the testing speed is too slow for high-density integrated circuits
Solution Approach 1:
The patent merges multiple detection functions into a single integrated system. Instead of using separate probe cards to test each chip individually, the display device's pixel array simultaneously detects multiple μLEDs across the entire display area. This combining of detection elements allows for parallel testing of numerous components, dramatically increasing testing speed while maintaining operational simplicity through unified control of the display device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and efficient testing of high-density integrated circuits and micro photoelectric chips, improving defect detection and sorting capabilities, and enhancing the visual effect by addressing the limitations of existing technologies in miniaturization and defect identification.
Implementation Method 1
The detection units are configured with at least one resilient conductive pillar, which can be compressed to electrically connect with the micro chips
Implementation Method 2
a plurality of image detecting units in array are disposed away from the electronic detection interface with a predetermined distance. The image detecting units in array are corresponded to the detection units of the electronic detection interface in a respect manner, and each of the image detecting units captures at least one image parameter from the corresponding one of the detection units
Data Source
AI summary
An electronic detection interface comprises a substrate structure and a plurality of detection units in array. The substrate structure includes a circuit film, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units.