Conductive Pillar Shielding Partition for Lower-Cost EMI Isolation
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Solution Overview
Problem
Current electromagnetic shielding solutions in electronic devices, such as those using precious metal conductive adhesives like gold and silver, are costly and provide inadequate conductivity, failing to effectively isolate components susceptible to interference.
Innovation Solution
A packaging module utilizing conductive pillars with higher conductivity than the adhesive, combined with a conductive adhesive, forms a partition structure that enhances electromagnetic isolation while reducing adhesive usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If precious metal conductive adhesive (gold and silver) is used for electromagnetic shielding, then conductivity is improved, but cost increases significantly
Solution Approach 1:
The conductive adhesive layer is segmented into an array of conductive pillars distributed across the substrate. This segmentation maintains the overall electromagnetic shielding function while using less total conductive material, thereby reducing cost while preserving shielding effectiveness.
Solution Approach 2:
The invention changes the physical state and distribution parameters of the conductive adhesive from a continuous layer to discrete pillars with specific spacing and dimensions. This parameter change optimizes the balance between conductivity, shielding effect, and material cost.
2Reliability
If continuous conductive adhesive layer is used, then electromagnetic shielding is achieved, but adhesive amount and cost increase
Solution Approach 1:
The continuous conductive adhesive layer is divided into discrete conductive pillars arranged in an array. This segmentation reduces the total volume of conductive adhesive required while maintaining electromagnetic shielding effectiveness through the distributed pillar structure.
Solution Approach 2:
Instead of uniform conductive adhesive distribution, the invention applies conductive material locally at specific pillar positions. This local quality approach concentrates shielding functionality where needed while reducing overall material consumption.
3Reliability
If metal partition structure is used to divide space, then electromagnetic isolation is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The invention merges the substrate, conductive pillars, and adhesive into an integrated structure. The conductive pillars are directly formed on the substrate and electrically connected to ground layers, eliminating the need for separate metal partition structures and reducing overall device complexity.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, electrical connection (through ground layers), and mounting for the conductive pillars. This multi-functionality reduces the need for additional specialized components like separate metal partitions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves conductivity and reduces costs by using conductive pillars, achieving better electromagnetic shielding with reduced adhesive amounts.
Implementation Method 1
a partition structure configured to perform electromagnetic isolation between every two adjacent device groups. The partition structure includes at least one conductive pillar and conductive adhesive, where a conductivity of the conductive pillar is greater than a conductivity of the conductive adhesive
Implementation Method 2
The plurality of conductive pillars are arranged at intervals, and there is a gap between any adjacent conductive pillars. The conductive adhesive fills the gap between any adjacent conductive pillars, and any adjacent conductive pillars are electrically connected by using the conductive adhesive
Data Source
AI summary
The technology of this application relates to a packaging module and a packaging method therefor, and an electronic device. The packaging module includes at least two device groups and a shielding structure configured to shield the at least two device groups. The shielding structure includes a partition structure configured to perform electromagnetic isolation between every two adjacent device groups. The partition structure includes a plurality of conductive pillars and conductive adhesive, and a conductivity of the conductive pillar is greater than a conductivity of the conductive adhesive. The plurality of conductive pillars are arranged at intervals and are electrically connected to a ground layer of a substrate, the conductive adhesive fills a gap between any adjacent conductive pillars, and any adjacent conductive pillars are electrically connected by using the conductive adhesive.