Conductive Pillar Formation via Paste Printing and Firing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The electroplating technique for forming conductive pillars in semiconductor packages is costly and time-consuming, and it can lead to issues like intermetallic compound formation and rough boundaries that affect conductivity and firmness.
Innovation Solution
A conductive particle structure comprising a metal core, a barrier layer, and multiple conductive layers, where the barrier layer surrounds the metal core and the conductive layers surround the barrier layer, is used, eliminating the need for electroplating and reducing manufacturing time and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electroplating technique is used to form conductive pillars, then conductive pillars can be formed, but manufacturing cost and time increase
Solution Approach 1:
The patent extracts and eliminates the electroplating process from the manufacturing flow, replacing it with a direct paste printing and firing method. This removes the harmful factor (electroplating) that causes increased cost and time, while still achieving the desired conductive pillar formation through alternative means (paste deposition and thermal processing).
Solution Approach 2:
The patent replaces the electrochemical system (electroplating) with a thermal processing system (firing). Instead of using electrical current to deposit metal, the invention uses thermal energy to sinter the conductive paste directly into the substrate, achieving conductive pillar formation without the complexities and costs of electroplating equipment and processes.
2Manufacturing precision
If electroplating technique is used to form conductive pillars, then conductive pillars can be formed, but manufacturing cost increases
Solution Approach 1:
The patent employs a disposable conductive paste that is printed directly onto the substrate and then fired. This single-use paste eliminates the need for expensive electroplating baths, anodes, and other electroplating infrastructure. The paste is applied, processed, and discarded after serving its purpose of forming the conductive pillar, significantly reducing manufacturing cost.
Solution Approach 2:
The patent replaces the expensive electrochemical system with a simpler thermal processing approach. Standard printing equipment and conventional firing furnaces are used instead of specialized electroplating lines, dramatically reducing capital equipment costs and operational expenses while maintaining manufacturing precision.
3Reliability
If electroplating technique is used, then conductive pillars are formed, but intermetallic compound formation and rough boundaries occur affecting conductivity and firmness
Solution Approach 1:
The patent converts the potential harm of uncontrolled intermetallic formation during electroplating into a benefit by using controlled thermal processing. The firing process creates a predictable metallurgical bond between the paste particles and substrate without the chaotic electrochemical reactions that generate harmful intermetallic compounds and rough boundaries, thereby improving conductivity and firmness.
Solution Approach 2:
The patent changes the fundamental processing parameters from electrochemical (voltage, current density, plating time) to thermal (firing temperature, heating rate, hold time). This parameter transformation eliminates the harmful side effects associated with electroplating while achieving the desired conductive pillar properties through controlled thermal sintering and metallurgical bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the conductivity and firmness of conductive pillars by preventing intermetallic compound formation and rough boundaries, thereby improving the efficiency and cost-effectiveness of the semiconductor package manufacturing process.
Implementation Method 1
the barrier layer surrounds the metal core
Implementation Method 2
The first conductive layer surrounds the barrier layer. The second conductive layer surrounds the first conductive layer
Implementation Method 3
the conductive element includes at least one conductive particle and a solder material covering the conductive particle
Data Source
AI summary
A semiconductor package device includes a carrier, a first electronic component, and a conductive element on the carrier. The first electronic component is over the carrier. The conductive element is on the carrier and electrically connects the first electronic component to the carrier. The conductive element includes at least one conductive particle and a solder material covering the conductive particle, and the conductive particle includes a metal core, a barrier layer covering the metal core, and a metal layer covering the barrier layer.