Conductive Pillar Resin Module for Lithography-Free RDL Wiring
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Solution Overview
Problem
Conventional semiconductor manufacturing methods require lithography techniques for forming copper pillar wiring, leading to increased manufacturing time and cost, and existing resin compositions are not suitable for miniaturized substrates due to high viscosity and lack of adhesion and durability.
Innovation Solution
A conductive pillar module precursor using a sheet-like cured resin material to support conductive pillars, which can be cured without lithography, providing adhesion, stress relaxation, and durability, suitable for secondary wiring and redistribution layers in semiconductor manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If lithography techniques are used for forming copper pillar wiring, then manufacturing precision is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent extracts and removes the lithography process from the manufacturing flow. Instead of using lithography to form copper pillar wiring, the invention directly forms copper pillars through a simplified process that eliminates the photoresist layer formation, lithography exposure, and photoresist removal steps, thereby reducing manufacturing time while maintaining precision
Solution Approach 2:
The manufacturing process is segmented into distinct stages: substrate preparation, copper pillar formation, and resin coating. This segmentation allows each stage to be optimized independently, with the copper pillar formation stage achieving precision without requiring the time-consuming lithography process
2Manufacturing precision
If lithography techniques are used for forming copper pillar wiring, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts and removes the lithography process from the manufacturing flow. Instead of using lithography to form copper pillar wiring, the invention directly forms copper pillars through a simplified process that eliminates the photoresist layer formation, lithography exposure, and photoresist removal steps, thereby reducing manufacturing time while maintaining precision
Solution Approach 2:
The invention replaces expensive lithography equipment and materials with simpler, more cost-effective tools and materials. The direct copper pillar formation process uses inexpensive masking materials and eliminates the need for costly lithography equipment, achieving the same precision at lower cost
3Reliability
If hot-melt curable granular silicone composition is used, then heat resistance and durability are improved, but melt viscosity increases
Solution Approach 1:
The patent uses a composite resin composition that combines silicone resin with other resin components. This composite formulation achieves the desired heat resistance and durability while maintaining lower melt viscosity, as the synergistic interaction between different resin components provides both thermal stability and flow properties
Solution Approach 2:
The invention changes the chemical composition parameters of the resin system. By adjusting the molecular weight distribution, crosslink density, and functional group content, the resin achieves optimal balance between heat resistance (high crosslink density) and melt viscosity (appropriate molecular weight and chain flexibility)
4Reliability
If resin with high inorganic filler content is used, then heat resistance is improved, but adhesion and processability deteriorate
Solution Approach 1:
The patent uses a composite resin composition that combines silicone resin with other resin components. This composite formulation achieves the desired heat resistance and durability while maintaining lower melt viscosity, as the synergistic interaction between different resin components provides both thermal stability and flow properties
Solution Approach 2:
The invention applies local quality optimization by using coupling agents on the surface of inorganic fillers. This creates a gradient structure where the filler core provides heat resistance while the surface treatment layer ensures good adhesion to the resin matrix and substrate, resolving the contradiction between heat resistance and adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces manufacturing steps and time while ensuring excellent adhesion and durability, enabling fine pitches and efficient secondary wiring without lithography, suitable for flip chip packages and redistribution layers.
Implementation Method 1
a curable resin composition is placed on the conductive pillar member, and then the curable resin composition is cured into a sheet shape
Implementation Method 2
The conductive pillar module precursor has sufficient adhesion to a substrate, stress relaxation properties, and durability
Data Source
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AI summary
The conventional technology cannot provide a conductive pillar module for semiconductor manufacturing that can be used for secondary wiring to a substrate of a flip chip package or for forming a redistribution layer (RDL) in a chip-last (RDL-first) package without using lithography techniques. A conductive pillar module precursor for semiconductor manufacturing, a semiconductor, or semiconductor precursor which has a structure in which a conductive pillar member is supported by a sheet-like cured resin material and provides sufficient adhesion to a substrate, stress relaxation properties, and durability, as well as a manufacturing method thereof.