Conductive Pillar Substrate for 3D Package Height and Thermal Management
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Solution Overview
Problem
Traditional three-dimensional (3D) packages face challenges in aligning inter-layer heights, leading to restricted height due to solder balls, which suppress lower components and result in poor cooling and reduced reliability, affecting the yield rate of the packaging process.
Innovation Solution
A substrate structure comprising a dielectric material layer, first and second conductive wiring layers, and conductive pillar layers with pillars of varying shapes (⊥, □, and shapes) to act as supports between inter-layers, reducing package height and enhancing rigidity and heat dissipation, achieved through a manufacturing method involving a carrier board and sequential layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If solder balls are used as supports to control inter-layer height, then alignment is achieved, but height is restricted and lower components are suppressed
Solution Approach 1:
The patent changes the physical parameters of the support structure by transitioning from spherical solder balls to柱状 (columnar) conductive supports with varying heights. This parameter change allows precise control of inter-layer spacing while avoiding the height restriction problem, as columns can be manufactured in different lengths to accommodate various component heights without suppressing lower components.
Solution Approach 2:
The patent segments the support structure into multiple conductive pillars with different heights rather than using uniform solder balls. This segmentation allows each pillar to be optimized for specific spacing requirements, enabling better alignment control while accommodating components of different heights and improving overall package height management.
2Adaptability or versatility
If more layers are added to increase system modules, then functionality is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent introduces heat dissipation pads as intermediary structures between the conductive pillars and the packaging substrate. These pads serve as thermal conduits that efficiently transfer heat from multiple stacked layers to the substrate, acting as a mediator that enables better heat dissipation in multi-layer configurations and resolving the thermal accumulation problem.
Solution Approach 2:
The patent addresses heat dissipation by transitioning from a two-dimensional surface problem to a three-dimensional thermal management solution. The columnar conductive pillars with varying heights create vertical thermal pathways, allowing heat to dissipate through the depth of the package rather than only laterally, thus improving heat dissipation effectiveness in multi-layer systems.
3Stability of the object's composition
If rigid conductors are used as supports, then structural stability is improved, but alignment control becomes difficult
Solution Approach 1:
The patent applies dynamic principles to the support structure by using conductive pillars with varying heights that can be selectively positioned and sized. This dynamic configuration allows the structure to adapt to different alignment requirements while maintaining stability, as the varying pillar heights provide flexibility in accommodating different component positions and orientations during the packaging process.
Data Source
AI summary
A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a dielectric material layer, a first conductive wiring layer, a second conductive wiring layer, a first conductive pillar layer, and a second conductive pillar layer. The first conductive wiring layer is disposed inside the dielectric material layer. The first conductive pillar layer having a first conductive pillar is disposed inside the dielectric material layer and between the first conductive wiring layer and the second conductive wiring layer. The second conductive pillar layer having a second conductive pillar is disposed on the second conductive wiring layer. The first conductive wiring layer and the second conductive wiring layer are electrically connected by the first conductive pillar layer. The second conductive pillar is a -shape conductive pillar, a -shape conductive pillar, or a -shape conductive pillar.