Conductive Pillars for Fine Pitch Electronic Package Bridging
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Solution Overview
Problem
Traditional semiconductor packaging methods face challenges with fine pitch solder ball formation, leading to bridging, poor co-planarity, and reliability issues due to variations in solder ball volume and height, resulting in decreased product yield and reliability.
Innovation Solution
The use of conductive pillars with narrower peripheral surfaces, formed by removing a metal plate to create recesses, which are bonded to a carrier structure and encapsulated, allowing for adjustable pitch and improved co-planarity, replacing traditional solder balls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used as supports and electrical connections between packaging substrates, then electrical connection is achieved, but bridging occurs more often as pitch decreases, resulting in poor product yield and reliability
Solution Approach 1:
The patent extracts the harmful wide peripheral surface of traditional solder balls that causes bridging. By removing the excess material and keeping only the necessary conductive core with a narrower peripheral surface, the invention eliminates the bridging issue while maintaining electrical connection functionality, thus improving reliability at fine pitch.
Solution Approach 2:
The invention changes the critical parameter of peripheral surface width of the conductive elements. By reducing the peripheral surface width compared to traditional solder balls, the patent enables finer pitch without bridging, directly resolving the contradiction between reliability and manufacturing precision.
2Reliability
If solder balls are formed by ball placing or screen printing, then electrical connections are created, but large variations in volume and height occur, leading to contact defects and poor electrical connections
Solution Approach 1:
The patent replaces the mechanical ball placing or screen printing processes with a precision manufacturing process that forms conductive pillars with controlled dimensions. This substitution eliminates the inherent variability of traditional methods, achieving uniform volume and height for improved electrical connection reliability.
3Reliability
If traditional solder balls are used to form a grid array, then electrical connections are established, but poor co-planarity occurs, causing unbalanced contact stress and tilted packaging substrates
Solution Approach 1:
The invention changes the shape parameter of the conductive elements by providing a narrower peripheral surface compared to traditional spherical solder balls. This geometric modification improves co-planarity across the grid array, ensuring uniform contact stress distribution and preventing substrate tilting, thus enhancing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents bridging, enhances product yield and reliability by achieving fine pitch and uniform height of conductive pillars, and improves bonding between encapsulation layers and conductive pillars, reducing delamination risks.
Implementation Method 1
the conductive frame is formed by removing a portion of a metal plate to form recesses that separate the conductive pillars
Implementation Method 2
bonding onto a carrier structure at least one electronic component and the conductive frame via the conductive pillars
Implementation Method 3
encapsulating the electronic component and the conductive pillars with at least one encapsulation layer
Data Source
AI summary
An electronic package is provided. An electronic component and a plurality of conductive pillars are provided on a carrier structure. An encapsulation layer encapsulates the electronic component and the conductive pillars. Each of the conductive pillars has a peripheral surface narrower than two end surfaces of the conductive pillar. Therefore, the encapsulation layer is better bonded to the conductive pillars. A method for fabricating the electronic package is also provided.