Conductive Pin and Flex PCB Layout for Compact Device Integration
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Solution Overview
Problem
Existing electronic devices face challenges in efficiently integrating multiple functions and components while maintaining compact size and efficient communication capabilities, particularly in portable devices where space is limited.
Innovation Solution
The electronic device incorporates a conductive pin with a first portion in a through-hole and a second portion extending into the housing, connected to a flexible circuit board and a second circuit board, allowing for improved electrical connections and component integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple functions and components are integrated into a single electronic device, then functionality and communication capabilities are enhanced, but device complexity and space requirements increase
Solution Approach 1:
The conductive pin is disposed within a through-hole formed in the housing, with its first portion inside the through-hole and second portion extending toward the inside of the housing. The board assembly is positioned between the second circuit board and the second portion of the conductive pin, creating a nested arrangement where components are embedded within the housing structure rather than arranged sequentially, reducing overall device complexity while maintaining multiple functions
Solution Approach 2:
The conductive pin extends in the thickness direction of the housing, utilizing the vertical dimension for electrical connections rather than only horizontal plane arrangements. This dimensional transition allows multiple components to be stacked vertically with improved spatial efficiency, reducing the footprint area while maintaining functionality
2Volume of moving object
If device size is reduced for portability, then convenience is improved, but space for electrical connections and components is reduced
Solution Approach 1:
The conductive pin and board assembly utilize the thickness direction (vertical dimension) for electrical connections, transitioning from planar to spatial arrangement. This allows electrical connections to be established within the limited volume by exploiting the vertical space, maintaining connection efficiency while reducing the horizontal footprint and overall device volume
Solution Approach 2:
The nested arrangement of the conductive pin within the through-hole and the board assembly positioned between circuit boards allows maximum utilization of available internal space. Components are embedded within the housing structure rather than occupying additional external space, reducing device volume while maintaining electrical connection efficiency
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing, a display, a first conductive pin, a first circuit board disposed within the housing, a second circuit board disposed within the housing and positioned closer to the first conductive pin than the first circuit board, and a substrate assembly of which at least a portion is disposed between the second circuit board and the second portion. The first conductive pin includes a first portion disposed in a through hole formed in one side of the housing and the second portion extending from the first portion toward an inside of the housing. The substrate assembly includes a flexible circuit board, at least one first conductive member disposed on the flexible circuit board and electrically connected to the second portion, and at least one second conductive member disposed on the flexible circuit board and electrically connected to the second circuit board.