Conductive Pin Resin Molded Housing Integration

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for fixing conductive pins to a substrate in electronic devices increase production costs and hinder size reduction, and often result in lowered positioning accuracy due to the use of separate members and connectors.

Innovation Solution

An electronic device design where conductive pins are directly mounted on the substrate with a resin molded portion including a projection that fits into a recess in the housing, eliminating the need for separate connectors and improving positioning accuracy through a U-shaped first projection and recess configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a connector separated from the casing is used to fix the conductive pin, then the conductive pin can be fixed to the substrate, but the production cost increases and device size reduction is hindered

Engineering Contradiction:
Improveproduction costVSAvoidnumber of parts
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The invention merges the connector and the casing into a single integrated structure. The conductive pins are directly embedded in the casing with their base portions exposed, eliminating the need for a separate connector component. This integration reduces the number of parts and simplifies the manufacturing process while maintaining the electrical connection function.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The invention extracts the connector function from the casing structure itself. Instead of adding a separate connector component, the casing is designed to directly provide the connector functionality through integrated conductive pins, thereby removing the unnecessary separate connector part and reducing overall device complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

2Manufacturing precision

If separate members such as a connector and fixing member are used to fix the conductive pin, then the conductive pin can be secured, but positioning accuracy is lowered due to accumulated tolerances

Engineering Contradiction:
Improvepositioning accuracy of conductive pinVSAvoidnumber of members
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention combines the positioning and fixing functions into a single integrated structure. The conductive pins are directly positioned and fixed within the casing without intermediate members, eliminating the accumulation of tolerances that would occur with multiple separate components. The direct integration ensures higher positioning accuracy while reducing the number of members.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If multiple members are used to fix the conductive pin, then the connection can be secured, but the contact performance and conduction performance are lowered

Engineering Contradiction:
Improvecontact performanceVSAvoidnumber of members
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention merges the conductive pins directly into the casing structure, creating a more reliable electrical connection by eliminating intermediate members that could introduce contact resistance or positioning errors. The direct integration ensures better contact performance and conduction reliability while simplifying the overall structure.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the number of device parts, lowers production costs, and enhances the positioning accuracy of conductive pins, leading to improved contact and conduction performance with mating connectors.

Implementation Method 1

a soldering portion soldered to the substrate

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentUS10305208B2Electronic device
Publication Date: 2019.05.28 TOYODA GOSEI CO LTD
  • US10305208B2 patent drawing
  • US10305208B2 patent drawing
  • US10305208B2 patent drawing

AI summary

An electronic device includes: a substrate; a housing which covers the substrate; a plurality of conductive pins which are mounted on one edge portion of the substrate and each of which includes: a projection portion projecting from the substrate along a plane of the substrate; and a soldering portion soldered to the substrate; and a resin molded portion which includes a connection portion connecting the plurality of conductive pins. The resin molded portion includes a first projection portion, and the housing includes a recess portion receiving the first projection portion.