Conductive Pipe Layer for Semiconductor Chemical Supply
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Solution Overview
Problem
In semiconductor manufacturing, electrostatic charges in chemical liquids used for cleaning substrates lead to particle adsorption on substrates, which affects the quality and yield of semiconductor devices, especially as device integration increases, and existing methods are inadequate for completely removing these charges.
Innovation Solution
A chemical liquid supply apparatus with a conductive layer made of non-metallic materials on the inner surface of the supply pipe and nozzle, along with a grounding conductor, is used to monitor and reduce or remove electric charges, employing a static electricity monitoring system to manage and control the electric charge levels in real-time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a chemical liquid is circulated through a pipe for substrate cleaning, then the cleaning effectiveness is improved, but electrostatic charges are generated in the chemical liquid due to friction, causing particle adsorption on substrates
Solution Approach 1:
A conductive layer is introduced as an intermediary between the chemical liquid and the pipe wall. This conductive layer acts as a mediator that facilitates charge transfer and prevents electrostatic charge accumulation in the chemical liquid, thereby resolving the contradiction between maintaining cleaning effectiveness and preventing harmful electrostatic charge generation
Solution Approach 2:
The electrical conductivity parameter of the pipe inner surface is changed by forming a conductive layer. This parameter change transforms the pipe from a non-conductive state that generates electrostatic charges to a conductive state that dissipates charges, eliminating the harmful effect while preserving the cleaning function
2Device complexity
If conventional pipes are used for chemical liquid supply, then the device complexity is low, but electrostatic charges cannot be effectively removed, leading to increased particle contamination
Solution Approach 1:
The pipe structure is transformed into a composite material system by adding a conductive layer on the inner surface of the pipe. This composite structure combines the mechanical properties of the pipe material with the electrical conductivity of the conductive layer, enabling effective charge removal while maintaining structural integrity and relatively simple device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces the electric charge on substrates, thereby minimizing particle adsorption and improving semiconductor device quality and yield by effectively managing electrostatic charges during the manufacturing process.
Implementation Method 1
electrostatic induction occurs at the chemical liquid and a liquid-contacting portion of a circulating pipe due to friction between the chemical liquid and the liquid-contacting portion
Implementation Method 2
a conductive layer including a first non-metallic conductive material... electrically connected to the conductive layer or the supply nozzle
Implementation Method 3
an electric charge is generated in the chemical liquid due to the electrostatic induction
Data Source
AI summary
A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.