Conductive Plastic Shielding Layer for Cable Extrusion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional cable shielding layers face issues with high melting points requiring high processing pressure and weak shielding performance, leading to potential damage and inadequate protection.
Innovation Solution
A conductive plastic composition comprising a resin with a low melting point, a toughened resin, conductive carbon black, superconductive carbon black, and a dispersant, along with optional additives like a coupling agent and redox agent, which enhances flowability and shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cable shielding layer compounds are used, then shielding performance can be achieved, but high melting point and high processing pressure are required which may damage core wire
Solution Approach 1:
The patent changes the melting point parameter of the compound by replacing traditional polyvinyl chloride base resin with low melting point resins (polyethylene, polypropylene, polymethylpentene) and adding specific additives like boron nitride and zinc stearate. This parameter change enables processing at lower temperatures (reducing from >200°C to 150-200°C) while maintaining shielding performance through optimized carbon black content (20-40 parts by weight) and compound composition.
2Reliability
If traditional cable shielding layer compounds are used, then shielding performance can be achieved, but high processing pressure is required which may break cable core wire
Solution Approach 1:
The patent changes the processing pressure parameter by modifying the compound's flow characteristics through resin selection and additive optimization. The low melting point resins and lubricants (zinc stearate, boron nitride) reduce viscosity and improve flowability, enabling extrusion at pressures below 100 MPa (reducing from >150 MPa) while achieving uniform shielding layer with proper carbon black dispersion (20-40 parts by weight).
Solution Approach 2:
The patent introduces intermediary substances (lubricants and release agents like zinc stearate and boron nitride) that mediate between the compound and processing equipment. These intermediaries reduce friction and adhesion, lowering required processing pressure while preventing core wire damage and ensuring smooth extrusion of the shielding layer.
3Reliability
If carbon black content is increased to improve shielding performance, then shielding efficiency improves, but compound viscosity increases making processing difficult
Solution Approach 1:
The patent optimizes the carbon black content parameter to 20-40 parts by weight (balancing shielding performance with processability) and changes the compound's rheological parameters through resin selection and additive optimization. The low melting point resins and lubricants counteract the viscosity increase from carbon black, maintaining flowability for easy extrusion while achieving required shielding efficiency.
Solution Approach 2:
The patent creates a composite material system combining low melting point resins (polyethylene, polypropylene, polymethylpentene), carbon black (20-40 parts by weight), and specific additives (boron nitride, zinc stearate, antioxidants). This composite structure achieves synergistic effects where the resin matrix provides processability and the carbon black provides shielding, with additives optimizing both properties simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive plastic reduces processing pressure and temperature, preventing core wire damage and improving shielding efficiency, making it suitable for wire cable shielding in electronic communications.
Implementation Method 1
conductive carbon black, superconductive carbon black
Implementation Method 2
shielding performance
Implementation Method 3
a dispersant 1%-3%
Implementation Method 4
a resin with a low melting point 42%-54%
Data Source
AI summary
The present invention discloses a conductive plastic, based on the total mass of the conductive plastic, which includes: a resin with a low melting point 42%-54%; a toughened resin 4%-10%; carbon black 33%-47%; a dispersant 1%-3%; wherein, the toughened resin is a polymer of acrylic acid and siloxane; and use thereof. The conductive plastic of the present invention has a low melting temperature and high conductive performance, and is suitable for a wire cable shielding layer.