Conductive Plastic Shielding for Thin Electronic Devices
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Solution Overview
Problem
The thickness of diecasting metal members in electronic devices is relatively large, and applying an electrically conductive film to holes or slots further increases the device's thickness, which is a problem in existing technologies.
Innovation Solution
An electronic device design that incorporates a stamped or forged metal member with a shielding member featuring a blocking portion made of electrically conductive plastic and an enclosing portion made of metal or electrically conductive plastic, which blocks electromagnetic waves and connects to the metal member and circuit board to form a shielding space, reducing the overall thickness by preventing electromagnetic wave radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electrically conductive film is stuck on a hole or slot of a diecasting metal member to prevent electromagnetic wave radiation, then electromagnetic shielding effectiveness is improved, but the thickness of the electronic device increases
Solution Approach 1:
The patent uses a composite structure combining a metal member (stamped or forged) with an electrically conductive plastic blocking portion. This composite approach replaces the traditional diecasting metal member with conductive film, achieving electromagnetic shielding through the conductive plastic material that fills the hole or slot, thereby preventing electromagnetic wave radiation without adding significant thickness.
Solution Approach 2:
The patent changes the material parameter from diecasting metal to stamped or forged metal with electrically conductive plastic. This parameter change allows the blocking portion to be made of electrically conductive plastic material that can be injection-molded directly into the hole or slot, eliminating the need for additional conductive film layers and reducing overall device thickness.
2Strength
If a diecasting metal member is used to provide structural support, then mechanical strength is improved, but the thickness of the electronic device increases
Solution Approach 1:
The patent changes the manufacturing method parameter from diecasting to stamping or forging. Stamped or forged metal members provide sufficient mechanical strength while allowing for thinner overall dimensions. The blocking portion is then integrated using injection molding, combining structural support with electromagnetic shielding functionality in a more space-efficient design.
Solution Approach 2:
The patent creates a composite structure where a stamped or forged metal member provides mechanical strength, and an electrically conductive plastic blocking portion provides both structural filling and electromagnetic shielding. This composite approach achieves both mechanical support and shielding functionality without the excessive thickness associated with diecasting metal members.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively shields electromagnetic waves while maintaining a thinner profile compared to diecasting metal members with conductive films, enhancing mechanical reliability and reducing manufacturing costs.
Implementation Method 1
the blocking portion is made of an electrically conductive plastic material... the blocking portion is configured to block the through hole or slot
Implementation Method 2
An electrically conductive elastic member is disposed between the enclosing portion and the circuit board or between the enclosing portion and the metal member
Data Source
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AI summary
Embodiments of the present invention disclose an electronic device and a shielding member production method. The electronic device includes: a metal member, a circuit board, and a shielding member, a through hole or slot is disposed on the metal member, and the metal member is a stamped metal member or a forged metal member; the circuit board is disposed opposite to the metal member, and an electronic component is disposed on the circuit board; the shielding member is fastened on the metal member, the shielding member includes a blocking portion and an enclosing portion, the blocking portion is made of an electrically conductive plastic material, the enclosing portion is made of a metal material or an electrically conductive plastic material, the blocking portion is configured to block the through hole or slot, the enclosing portion is disposed around the electronic component, one end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board; and the metal member, the blocking portion, the enclosing portion, and the circuit board form shielding space, and the electronic component is located in the shielding space.