Thermally Conductive Plastic Composition With Rounded Silicon Fillers
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Solution Overview
Problem
Existing thermally conductive plastics face challenges such as high weight, cost, electrical conductivity, flammability, and processability issues due to the use of ceramic, metallic, and silicon fillers, which limit their application in electric vehicles and electronic components.
Innovation Solution
A thermally conductive plastics composition containing predominantly rounded silicon particles with a specific size range (30-200 μm) and aspect ratio (0.76) and a broad particle size distribution, combined with other thermally conductive fillers, to achieve high thermal conductivity (0.6 W/mK) while minimizing flammability and maintaining low viscosity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If ceramic fillers such as aluminum oxide are used to increase thermal conductivity, then thermal conductivity is improved, but weight increases significantly and cost increases
Solution Approach 1:
The patent changes the particle size parameter of silicon filler from fine (milled) to coarse (30-200 μm), which fundamentally alters the relationship between thermal conductivity and weight. Coarse particles provide sufficient thermal pathways while occupying less volume per unit thermal conductivity contribution, reducing overall density and weight of the composite material.
Solution Approach 2:
The patent creates a composite material system using silicon particles combined with polymer matrix, replacing traditional ceramic filler systems. This composite approach achieves comparable or superior thermal conductivity to ceramic fillers while maintaining lower density and weight, as silicon has favorable density properties compared to aluminum oxide.
2Temperature
If milled silicon particles are used as thermally conductive filler, then thermal conductivity is improved, but viscosity increases significantly and processability deteriorates
Solution Approach 1:
The patent changes the particle size parameter from fine milled silicon to coarse silicon particles (30-200 μm). This parameter change reduces the total surface area of filler particles, thereby reducing polymer-filler interfacial interactions and significantly lowering the viscosity increase. The coarse particles maintain thermal conductivity effectiveness while preserving processability for dispensing and molding operations.
3Temperature
If small silicon particles smaller than 30 μm are used, then thermal conductivity is improved, but flammability increases and dust explosion hazard arises
Solution Approach 1:
The patent changes the particle size parameter to coarse particles (30-200 μm), which has a direct impact on flammability characteristics. Larger particles have lower surface area to volume ratio, reducing the total reactive surface area exposed to oxygen and heat. This parameter change suppresses dust explosion hazards and reduces flammability while maintaining thermal conductivity through adequate particle networking in the composite structure.
4Temperature
If high filler content is used to achieve high thermal conductivity, then thermal conductivity is improved, but the composition becomes stiff and cannot be dispensed
Solution Approach 1:
The patent changes the particle size parameter to coarse particles (30-200 μm), which allows achieving high thermal conductivity at high filler contents without excessive viscosity increase. The reduced specific surface area of coarse particles minimizes polymer-filler interactions, keeping the composite composition sufficiently fluid for dispensing operations even at high filler loadings, thereby resolving the contradiction between thermal conductivity and dispensability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved thermal conductivity, reduced flammability, and enhanced processability, making it suitable for electric vehicles and electronic components without the drawbacks of traditional fillers.
Implementation Method 1
thermally conductive plastics composition containing rounded silicon particles... achieve high thermal conductivity (0.6 W/mK)
Data Source
AI summary
Thermally conductive plastic compositions, methods of producing and uses for the same. Where the thermally conductive plastics composition (Y) includes 5-50% by volume of a non-silicone-based plastics composition(S), 50-95% by volume of at least one thermally conductive filler (Z) having a thermal conductivity of at least 5 W/mK and the thermally conductive plastics composition (Y) has a thermal conductivity of at least 0.6 W/mK. At least 20% by volume of the metallic silicon particles are present as thermally conductive fillers (Z) that: (i) average diameter x50 is in the range 30-200 μm, (ii) are predominantly rounded and characterized in that the width/length ratio (aspect ratio w/l) is at least 0.76, and (iii) are distribution width SPAN ((x90−x10)/x50) is at least 0.28.