Conductive Plate Gap Reduction for Low Parasitic Inductance
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Solution Overview
Problem
Conventional methods for manufacturing electronic apparatuses with high-voltage and low-voltage side electric conductors struggle to reduce the distance between these conductors below the thickness of a conductive plate, leading to increased parasitic inductance and manufacturing costs.
Innovation Solution
A method involving a conductive plate from which high-voltage and low-voltage side electric conductors are formed in parallel, with initial gaps created by punching, subsequently deformed to reduce the gap size, and sealed with a sealing material to achieve smaller distances between the conductors without being limited by stable machining criteria.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If the distance between high-voltage side and low-voltage side electric conductors is reduced below the thickness of the conductive plate, then parasitic inductance is reduced, but manufacturing precision and stable machining criteria are compromised
Solution Approach 1:
The conductive plate is divided into multiple sections: first and second electric conductors are separated by a through-hole, with intermediate conductors bridging the gap. This segmentation allows the distance between high-voltage and low-voltage conductors to be reduced below the plate thickness while maintaining manufacturing feasibility through standard punching operations.
Solution Approach 2:
Intermediate conductors are introduced as mediator elements that bridge the gap between the first and second electric conductors. These intermediate conductors are positioned through the through-hole and connect to both sides, enabling the main conductors to be placed closer together than the plate thickness would normally allow, thus reducing parasitic inductance while maintaining stable machining criteria.
2Object-generated harmful factors
If high-voltage side and low-voltage side electric conductors are separately prepared and arranged with small distance, then parasitic inductance is reduced, but manufacturing complexity and cost increase
Solution Approach 1:
Multiple electric conductors (first conductor, second conductor, and intermediate conductors) are merged into a single conductive plate structure. All conductors are formed in one plate with through-holes, allowing them to be processed together using standard punching operations. This merging reduces manufacturing complexity and cost compared to separately preparing and assembling multiple conductors, while achieving the low parasitic inductance goal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the reduction of parasitic inductance and manufacturing costs by enabling smaller gaps between high-voltage and low-voltage side electric conductors, improving the performance of electronic apparatuses while maintaining processing accuracy.
Implementation Method 1
deformed to reduce the gap size
Implementation Method 2
sealed with sealing material
Data Source
AI summary
Multiple high-voltage side and low-voltage side electric conductors are formed from one sheet of a conductive plate in such a way that the multiple electric conductors are arranged in parallel to one another across an initial gap between the high-voltage side and the low-voltage side electric conductors. The multiple electric conductors are connected to one another via connecting portions. An intermediate portion of the connecting portion is deformed so as to reduce the initial gap to a smaller adjusted gap. Portions of the electric conductors as well as switching devices mounted to the electric conductors are sealed by sealing material. The connecting portions are cut away so that the electric conductors are finally separated from one another.