Conductive Plate Interconnect for Precision Electrical Components
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Solution Overview
Problem
Existing manufacturing methods for electrical components, such as capacitors and resistors, face challenges in achieving precise electrical parameters due to deviations of 10% to 20% from nominal values, leading to poor yield and increased Equivalent Series Resistance (ESR) when trying to match component values or trim components, which are costly and inefficient.
Innovation Solution
A method involving the formation of a conductive plate that connects the top electrodes of selected sub-components to form electrical components with desired parameter values, using a mask-less process to create an insulating layer and ensure negligible resistance, allowing for precise matching of electrical parameters across multiple sub-components without adding significant resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser fusing is used to open selected wires connecting sub-components, then the component can be trimmed to present a desired electrical parameter value, but the heat from the lasers may damage the device and increases the Equivalent Series Resistance (ESR)
Solution Approach 1:
The patent extracts the harmful wire interconnections from the final component structure. Instead of using wires to connect sub-components, the invention directly connects selected sub-components through a conductive plate, eliminating the source of ESR and heat damage while achieving precise electrical parameter control through selective connection of sub-components with complementary tolerance deviations
Solution Approach 2:
The patent introduces a conductive plate as an intermediary element that directly connects the top electrodes of selected sub-components. This plate serves as a low-resistance interconnection medium that eliminates the need for wire bonding, thereby reducing ESR and avoiding laser-induced heat damage while enabling precise electrical parameter matching
2Manufacturing precision
If active components such as switches are used to connect or disconnect sub-components, then the component can be trimmed to present a desired electrical parameter value, but adding active components is costly and increases the ESR
Solution Approach 1:
The patent extracts active components (switches) from the component structure entirely. Instead of using switches to connect or disconnect sub-components, the invention uses a passive conductive plate to permanently connect selected sub-components during manufacturing, eliminating the need for active trimming components and their associated cost and ESR
Solution Approach 2:
The patent performs the selection and connection of sub-components during the initial manufacturing process rather than requiring later trimming operations. The conductive plate is formed to connect specifically selected sub-components in advance, achieving precise electrical parameter values without needing active components for post-manufacturing adjustment
3Productivity
If silicon manufacturing technologies are used to manufacture electrical components, then components can be produced with increased capacitance values, but there is a spread of plus or minus 10% to 20% around a nominal value for the capacitance or resistance
Solution Approach 1:
The patent divides the electrical component into multiple sub-components (e.g., multiple capacitor elements) that are manufactured using standard silicon technology. Each sub-component has a nominal value with typical tolerance spread, but by segmenting the total capacitance into multiple units, the system enables precise total value control through selective combination
Solution Approach 2:
The patent implements a feedback mechanism where the actual measured values of sub-components are used to determine which sub-components to connect. By measuring the capacitance or resistance of individual sub-components and using this information to select and connect sub-components with complementary deviations, the system achieves precise total electrical parameter values that approximate the desired nominal value
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
A method of fabricating a device comprising at least one electrical component (101) comprising: - forming, above a substrate (102), a plurality of sub-components (C1, ..., C4) each having a top electrode, - measuring an actual value of an electrical parameter of at least one sub-component of the plurality of sub-components, - forming a conductive plate (104) for connecting together the top electrodes of sub-components of a group of selected sub-components belonging to the plurality of sub-components so as to form the electrical component having a value of the electrical parameter which approximates a desired value, by taking into account the actual value of the at least one sub-component. The invention also concerns the corresponding device.