Conductive Plate Clip Stress Buffering for Power Modules
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Solution Overview
Problem
As power from power modules increases, heat dissipation becomes more challenging, and existing technologies struggle to effectively manage stress on electronic components during the manufacturing process of power modules, leading to potential deterioration of component characteristics and increased complexity.
Innovation Solution
The electronic device incorporates conductive plates with connecting portions, such as clips, that are configured to buffer stress from the conductive plates to the electronic components, improving yield and reducing the need for additional solder, while also enhancing heat dissipation through strategically placed heat dissipation structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power from power modules increases to fulfill higher charge rates, then power transmission efficiency is improved, but heat dissipation becomes more challenging
Solution Approach 1:
The patent divides the power module into multiple independent conductive plates (first conductive plate, second conductive plate) with separate heat dissipation structures. Each conductive plate has its own heat dissipation structure that can independently dissipate heat, allowing for better thermal management as power increases.
Solution Approach 2:
The patent introduces vertical stacking of multiple conductive plates with heat dissipation structures extending in different spatial dimensions. The heat dissipation structures are positioned at different heights and orientations, utilizing three-dimensional space to increase surface area for heat dissipation without increasing the horizontal footprint.
2Reliability
If existing technologies are used to manage stress on electronic components, then manufacturing process is simple, but component characteristics deteriorate and yield decreases
Solution Approach 1:
The patent introduces connecting portions as intermediary elements between the conductive plates and electronic components. These connecting portions act as stress-absorbing intermediaries that decouple the rigid conductive plates from the sensitive electronic components, preventing direct stress transmission while maintaining electrical and mechanical connections.
Solution Approach 2:
The connecting portions have non-perpendicular sections that change the geometric parameters of the connection. This angular design allows the connecting portions to flex and absorb stress through geometric deformation, changing the stress transmission parameters from direct rigid coupling to flexible angular connection.
3Strength
If additional solder is used to secure conductive plates, then connection strength is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The connecting portions are designed to be self-securing through their clip structure. The connecting portions can be formed as integral parts of the conductive plates and can mechanically engage with the electronic components without requiring additional soldering processes. The clip design allows for self-locking or snap-fit connections that provide sufficient mechanical strength.
Data Source
AI summary
An electronic device is disclosed. The electronic device includes a first conductive plate and a first electronic component. The first conductive plate includes a first connecting portion. The first electronic component supports the first conductive plate through the first connecting portion. The first connecting portion is electrically connected to the first electronic component and configured to buffer stress from the first conductive plate to the first electronic component.