Conductive Plate Substrate for IC Package Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing integrated circuit packaging methods require different substrates for various semiconductor dies and rely on adhesive plastic tapes, leading to increased costs and complexity, while also limiting miniaturization and thermal management.
Innovation Solution
Using a partially patterned conductive plate as a substrate, where a partial circuit pattern is formed on one side, and at least one semiconductor die is electrically coupled to it, allowing for encapsulation and the formation of conductive traces, which eliminates the need for via-formation and adhesive tapes, enabling miniaturization and improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional substrates (PGA or BGA) are used for IC packaging, then electrical connections can be established, but the package size increases and thermal management becomes difficult
Solution Approach 1:
The patent extracts the substrate function from traditional PGA/BGA configurations and implements it directly through the conductive plate structure. The conductive plate serves as both the mounting surface and the electrical connection medium, eliminating the need for separate substrate layers and via structures, thereby reducing package size while maintaining thermal management capabilities through direct thermal coupling.
Solution Approach 2:
The patent changes the physical parameters of the packaging structure by using a conductive plate with controlled thickness (0.5mm to 2mm) and conductivity properties. This allows the substrate to provide both electrical connection and thermal management functions simultaneously, reducing the overall package volume while improving heat dissipation compared to traditional multi-layer substrate approaches.
2Adaptability or versatility
If different substrates are used for different semiconductor dies, then each die can be optimally supported, but inventory costs and processing complexity increase
Solution Approach 1:
The conductive plate is designed as a universal substrate that can accommodate different types and arrangements of semiconductor dies through its modular structure. The plate's conductive surface can be selectively patterned to provide electrical connections for various die configurations, eliminating the need for multiple specialized substrate types and simplifying inventory management while maintaining adaptability to different packaging requirements.
3Ease of operation
If adhesive plastic tape is used as a carrier for semiconductor dies, then dies can be handled during processing, but costs and processing steps increase
Solution Approach 1:
The patent removes the adhesive plastic tape carrier from the manufacturing process by directly mounting semiconductor dies onto the conductive plate using alternative attachment methods such as soldering or conductive adhesive applied directly to the plate surface. This eliminates the tape layer and associated handling steps, reducing manufacturing cost and simplifying the overall process while maintaining die handling capability throughout fabrication.
4Reliability
If via-formation through the substrate is performed, then electrical connections can be established, but manufacturing complexity and cost increase
Solution Approach 1:
The patent eliminates the via-formation process by using the conductive plate surface directly for electrical connections. Conductive traces are formed on the plate surface through patterning techniques, and dies are connected directly to these traces without requiring through-substrate vias. This approach maintains reliable electrical connections while significantly simplifying manufacturing by removing the complex via drilling, plating, and filling steps required in traditional substrate approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces costs, simplifies processing, allows for miniaturization, and enhances thermal management by using an inexpensive conductive plate as a substrate, enabling flexible placement of dies and components within the IC package, and facilitating the stacking of packages.
Implementation Method 1
using the conductive plate as the substrate provides for better thermal management during packaging because the electrical and/or mechanical coupling of a die to the conductive plate provides for relatively high thermal dissipation from the die
Data Source
AI summary
A method of making integrated circuit packages using a conductive plate as a substrate includes forming a partial circuit pattern on one side of the conductive plate by stamping or selectively removing a portion of the conductive plate through part of its thickness, and then electrically coupling semiconductor dies to the formed patterns on the conductive plate. The method further includes encapsulating at least a portion of the dies and the conductive plate with an encapsulant and removing a portion of the conductive plate from the side opposite the patterned side to form conductive traces based on the formed pattern.