Conductive Plug Capacitor Array Layout for Deformation Stress Relief
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Solution Overview
Problem
The existing semiconductor structures face deformation stress issues due to thermal expansion mismatch between conductive plugs and dielectric layers, which can damage functional elements and limit chip integration, as current solutions like grounded isolation rings do not effectively address substrate and dielectric layer deformation.
Innovation Solution
Incorporating a capacitor array surrounding the conductive plug to attenuate deformation stress, with multiple capacitor circuits and interfaces that hinder stress transmission, ensuring minimal impact on functional zones and allowing for higher element density and effective performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive plug is formed in the substrate and dielectric layer for chip interconnection, then interconnection between chips is achieved, but deformation stress is generated due to thermal expansion mismatch which can damage functional elements
Solution Approach 1:
A capacitor array is introduced as an intermediary structure between the conductive plug and the functional elements. The capacitor array includes multiple capacitor circuits with electrodes and dielectric layers that act as a buffer zone, intercepting and dispersing the deformation stress before it reaches the functional elements, thereby protecting them while maintaining interconnection reliability
Solution Approach 2:
The stress transmission path is segmented by introducing multiple capacitor circuits arranged in an array. Each capacitor circuit acts as an independent stress-blocking unit, dividing the continuous stress field into discrete segments. This segmentation prevents stress concentration and enables the stress to be distributed and attenuated across multiple interfaces, reducing the overall impact on functional elements
2Object-affected harmful factors
If traditional grounded isolation rings are used to address deformation stress, then some stress protection is provided, but they do not effectively prevent substrate and dielectric layer deformation and damage to functional elements
Solution Approach 1:
The grounded isolation ring is replaced by a segmented capacitor array consisting of multiple discrete capacitor circuits. Each capacitor circuit creates multiple interfaces between electrodes and dielectric layers, which act as stress-blocking boundaries. This segmentation provides more effective stress protection compared to the continuous isolation ring, as it creates numerous discrete barriers to stress transmission throughout the structure
Solution Approach 2:
The capacitor array utilizes composite material structures with alternating conductive electrodes and dielectric layers. This composite arrangement creates interfaces with different mechanical properties that can absorb and dissipate deformation stress. The combination of conductive and dielectric materials provides both electrical functionality and mechanical stress management, effectively protecting functional elements while maintaining structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The capacitor array effectively reduces deformation stress on functional elements, enabling better performance and integration of semiconductor structures by minimizing stress impact on the functional zone, while maintaining high element density and structural stability.
Implementation Method 1
a capacitor array, the capacitor array at least surrounding the second portion of the conductive plug
Data Source
AI summary
A semiconductor structure includes: a substrate and a dielectric layer arranged on the substrate; a conductive plug, a first portion of the conductive plug being arranged in the substrate, and a second portion of the conductive plug being arranged in the dielectric layer; and a capacitor array, the capacitor array at least surrounding the second portion of the conductive plug.