Conductive Plug Via Filling in Microelectronic Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional microelectronic device packaging processes are time-consuming and expensive, particularly in forming wire-bonds that can withstand molding compound forces and attaching dies to interposer substrates or lead frames, which may damage the dies, and stacked-die arrangements face challenges with increased footprint due to solder ball positioning and complex wire-bond installation.
Innovation Solution
The method involves forming conductive interconnects in microelectronic devices by creating passages through microfeature workpieces and depositing conductive materials using maskless mesoscale deposition, electronic printing, or nano-particle processes to form plugs and fill passages, which can seal and connect bond-pads efficiently, reducing the need for wire-bonds and minimizing die damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonding is used to connect dies to interposer substrates, then electrical connections can be established, but the process becomes time-consuming and expensive, and wire-bonds may be damaged by molding compound forces
Solution Approach 1:
The patent removes wire-bonds from the packaging process entirely by forming conductive plugs directly through the die to establish electrical connections. This extraction of the wire-bonding step eliminates both the time consumption and reliability issues associated with wire-bonds while being susceptible to molding compound forces.
Solution Approach 2:
The patent replaces the mechanical wire-bonding process with a direct conductive plug formation process. Instead of mechanically attaching wire-bonds to bond-pads and routing them to interposer substrates, the invention uses deposition techniques to form conductive material plugs that extend through the die, substituting a simpler, more reliable process.
2Reliability
If individual dies are attached to interposer substrates, then electrical connections can be established, but the process becomes expensive and may damage the bare dies
Solution Approach 1:
The patent merges the die attachment process with the conductive interconnect formation process. Instead of separately attaching dies to interposer substrates and then forming connections, the invention forms conductive plugs through the die that directly establish connections, combining multiple steps into a more integrated and cost-effective process.
Solution Approach 2:
The patent extracts the die attachment step from the conventional process by eliminating the need for separate die mounting to interposer substrates. The conductive plugs are formed directly through the die, removing the intermediate attachment step that adds cost and potential damage risk.
3Productivity
If stacked-die arrangements are used to increase component density, then device performance can be improved, but the footprint increases due to solder ball positioning and wire-bond installation complexity
Solution Approach 1:
The patent removes wire-bonds and complex solder ball positioning from stacked-die arrangements by forming conductive plugs through the dies. This extraction eliminates the need for additional space required for wire-bond routing and complex solder ball placement, reducing the overall footprint while maintaining high component density.
Solution Approach 2:
The patent transitions from planar wire-bond connections to vertical conductive plug connections through the die. By moving connections into the vertical dimension through the die thickness, the invention eliminates the need for lateral wire-bond routing space, enabling higher component density within a smaller footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances packaging efficiency, reduces costs, and decreases the footprint of microelectronic devices by eliminating the need for complex wire-bonding and minimizing die damage during attachment, while enabling high-density interconnects in stacked arrangements.
Implementation Method 1
depositing conductive materials using maskless mesoscale deposition
Implementation Method 2
electronic printing
Implementation Method 3
nano-particle processes to form plugs and fill passages
Data Source
AI summary
Microelectronic devices and methods for filling vias and forming conductive interconnects in microfeature workpieces and dies are disclosed herein. In one embodiment, a method includes providing a microfeature workpiece having a plurality of dies and at least one passage extending through the microfeature workpiece from a first side of the microfeature workpiece to an opposite second side of the microfeature workpiece. The method can further include forming a conductive plug in the passage adjacent to the first side of the microelectronic workpiece, and depositing conductive material in the passage to at least generally fill the passage from the conductive plug to the second side of the microelectronic workpiece.