Conductive Polyimide Adhesive for Solar Cell Substrate Bonding
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Solution Overview
Problem
The manufacturing of III-V compound semiconductor multijunction solar cells for high-efficiency solar power applications faces challenges due to complex material choices and fabrication steps, particularly in achieving high energy conversion efficiencies and radiation resistance while minimizing size, mass, and cost.
Innovation Solution
A method for manufacturing solar cells involving a semiconductor growth substrate with a sequence of semiconductor layers, a metal contact layer, and a permanent supporting substrate of carbon fiber reinforced polymer bonded using a conductive polyimide binding resin, allowing for the creation of inverted metamorphic multijunction solar cells with improved structural integrity and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If III-V compound semiconductor multijunction solar cells are used to achieve high energy conversion efficiency, then energy conversion efficiency is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The solar cell structure is divided into multiple functional layers including semiconductor layers, metal contact layers, and adhesive layers, each with specific purposes. This segmentation allows optimization of each layer independently while achieving high overall efficiency
Solution Approach 2:
The patent uses composite material structures combining III-V compound semiconductors with metal contacts and polyimide adhesives. This composite approach enables high energy conversion efficiency while providing structural stability and ease of manufacturing
2Ease of manufacture
If conventional adhesive layers are used to bond solar cells, then ease of manufacture is improved, but electrical conductivity is lost
Solution Approach 1:
The patent employs conductive polyimide adhesive that combines the bonding properties of conventional adhesives with electrical conductivity. This composite material eliminates the need for separate adhesive and conductive layers, maintaining ease of manufacture while ensuring electrical connectivity
Solution Approach 2:
The conductive polyimide adhesive performs multiple functions simultaneously: it bonds the metal contact layer to the semiconductor layer, provides electrical conductivity for current collection, and offers environmental protection. This multi-functionality simplifies the overall device structure
3Reliability
If metal contact layers are applied to enhance electrical conductivity, then electrical conductivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the metal contact layer formation with the adhesive bonding process. The conductive polyimide adhesive is applied directly over the metal contact layer, merging two fabrication steps into one and reducing overall manufacturing complexity while maintaining electrical conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the energy conversion efficiency and radiation resistance of solar cells, reducing their size and mass while maintaining high power output, making them suitable for space and terrestrial applications.
Implementation Method 1
permanently bonding it thereto by a thermocompressive technique
Implementation Method 2
III-V compound semiconductor multijunction solar cells have greater energy conversion efficiencies
Data Source
AI summary
The present disclosure provides a method of manufacturing a solar cell comprising: providing a semiconductor growth substrate; depositing on said growth substrate a sequence of layers of semiconductor material forming a solar cell; applying a metal contact layer over said sequence of layers; and affixing the surface of a permanent supporting substrate composed of a carbon fiber reinforced polymer utilizing a conductive polyimide binding resin directly over said metal contact layer and permanently bonding it thereto by a thermocompressive technique.