Conductive Polymer Bond Layer for Electroluminescent Common Electrode
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Solution Overview
Problem
Existing methods for manufacturing electroluminescent devices face issues with mechanical stress concentration at the common electrode, leading to potential electrical discontinuity and require lengthy and expensive removal of temporary substrates, while being unsatisfactory in handling out-of-flatness during assembly.
Innovation Solution
A method involving the use of a bond layer made of electrically conducting organic polymer material, which is at least partially transparent to light, is retained after substrate removal, forming a common electrode with a thickness greater than 20 nm, providing enhanced mechanical strength and flexibility to accommodate non-flatness, and includes intermediate layers and through openings to maintain electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a common electrode is formed to cover the trenches for maintaining electrical continuity, then electrical connection is improved, but mechanical strength deteriorates due to stress concentration at the trench locations
Solution Approach 1:
The patent applies composite materials by combining an organic polymer material with metallic particles (such as silver, aluminum, or copper) to create a common electrode that exhibits both electrical conductivity and enhanced mechanical strength. The metallic particles are dispersed within the polymer matrix, creating a composite structure that resolves the contradiction between electrical continuity and mechanical strength by providing both functions simultaneously without stress concentration issues.
2Ease of manufacture
If the temporary substrate is completely removed after assembly, then the manufacturing process is completed, but the process becomes lengthy and expensive
Solution Approach 1:
The patent extracts only the necessary portions of the temporary substrate for removal while retaining other portions that serve functional purposes. Specifically, the temporary substrate is removed from areas where it is no longer needed, but retained in areas where it provides beneficial functions such as mechanical support or stress absorption, thereby reducing the time and cost of removal while maintaining manufacturing simplicity.
Solution Approach 2:
The patent introduces a bond layer as an intermediary between the electroluminescent structures and the temporary substrate. This bond layer facilitates the assembly process and allows for selective removal of the temporary substrate while maintaining the integrity of the electroluminescent structures, thereby simplifying the manufacturing process and reducing time loss.
3Strength
If a thick bond layer is used to assemble electroluminescent structures on the temporary substrate, then mechanical strength is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent applies multi-functionality by designing the bond layer to serve multiple functions simultaneously: it provides mechanical strength for assembly, acts as an electrical insulator, and serves as a template for forming the common electrode. The organic polymer material with dispersed metallic particles creates a multi-functional layer that reduces manufacturing complexity by eliminating the need for separate layers for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves mechanical strength and reliability of electroluminescent devices by maintaining a robust common electrode and simplifies the manufacturing process, making it more tolerant to assembly flatness issues and reducing the complexity of temporary substrate removal.
Implementation Method 1
an adhesion layer adapted to form a common electrode for the electroluminescent structures and to absorb mechanical stresses that could occur during the manufacturing process
Implementation Method 2
the bond layer, that comprises an electrically conducting organic polymer material
Implementation Method 3
which is at least partially transparent to light radiation
Data Source
AI summary
A method of manufacturing a device includes: —a) a first step for the formation of a temporary structure that comprises electroluminescent structures separated by trenches and comprising an electroluminescent face, the electroluminescent structures being bonded by means of a bond layer on a temporary substrate; b) an assembly step bringing the electroluminescent structures into contact with a host face of a host substrate; and c) a step for removal of the temporary substrate; wherein the bond layer, that comprises an electrically conducting organic polymer material at least partially transparent to light radiation, is at least partly kept after step c) and forms an electrode common to the light emitting faces, with a thickness of more than 20 nm.