Conductive Polymer Circuit Board via Atom Transfer Radical Polymerization
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Solution Overview
Problem
Existing circuit boards face challenges in electrically connecting a copper layer to a solder mask layer using chemical or electroplating processes, and the copper layer connected in this manner is prone to peeling.
Innovation Solution
A conductive polymer is synthesized through atom transfer radical polymerization of liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, which is then used to form a composite film with a base layer and adhesive layer, allowing for stable electrical connection through a copper layer and solder mask layer via a through hole, enhancing electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chemical plating or electroplating process is used to connect copper layer to solder mask layer, then electrical connectivity is achieved, but the copper layer becomes easily peelable and connection reliability deteriorates
Solution Approach 1:
A conductive polymer layer is introduced as an intermediary between the copper layer and solder mask layer. This conductive polymer serves as a bonding bridge that chemically adheres to both the copper substrate and the solder mask, eliminating the peeling issue associated with traditional plating methods while maintaining electrical conductivity for signal transmission.
2Object-affected harmful factors
If traditional electromagnetic shielding layer with copper and adhesive is used, then electromagnetic shielding is provided, but electrical connection between layers is difficult and peeling occurs
Solution Approach 1:
The invention employs a composite structure consisting of a conductive polymer layer integrated with the electromagnetic shielding layer. This conductive polymer composite provides both electromagnetic shielding capabilities and reliable electrical connection properties, combining the benefits of traditional shielding materials with improved adhesion and connection stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved electrical connectivity and reduced peeling of the copper layer, resulting in enhanced electromagnetic signal blocking capabilities, as demonstrated by improved eye patterns in signal waveforms at 5 Gbps and 10 Gbps transmission.
Implementation Method 1
A conductive polymer is synthesized through atom transfer radical polymerization of liquid crystal monomers, a silver complex, an initiator, and a catalytic agent
Implementation Method 2
the silver complex is wrapped in the conductive polymer which causes the conductive polymer to be electrically conductive
Data Source
AI summary
A circuit board includes a flexible board, a composite film, and a copper layer. The composite film is formed on the flexible board and defines at least one through hole. The composite film includes a base layer having an active surface, and a conductive layer formed by coated a conductive polymer on the active surface. The conductive polymer is made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization. The copper layer covers the conductive layer and an inner wall of each of the at least one through hole. The copper layer is electrically connected to the flexible substrate by the through hole.