Conductive Polymer Composite for Additive Manufacturing
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Solution Overview
Problem
Current additive manufacturing methods using electrically conductive low temperature polymers are limited in producing high temperature, high strength, and conductive 3D objects due to issues with material strength loss, resistive melting, and poor flow behavior of high temperature polymer-filler compositions.
Innovation Solution
A composite material is developed comprising a high temperature polymer, an electrically conductive or strengthening filler, and an extrudability component, which improves rheological properties and ensures uniform distribution of fillers, enabling the formation of 3D objects with enhanced mechanical and electrical homogeneity suitable for high temperature applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high temperature polymers with filler components are used to achieve high strength and electrical conductivity, then material strength and electrical conductivity are improved, but viscosity increases and flow behavior deteriorates
Solution Approach 1:
A processing aid component is introduced as an intermediary substance between the polymer matrix and filler components. This processing aid modifies the rheological properties of the polymer-filler composition, reducing viscosity and improving flow behavior during extrusion without compromising the strength-enhancing effects of the filler components or the electrical conductivity provided by conductive fillers.
Solution Approach 2:
The patent modifies the chemical and rheological parameters of the polymer-filler composition by incorporating specific processing aids that change the flow characteristics. This allows the composition to exhibit improved extrudability and flow behavior while maintaining the high strength and electrical conductivity properties achieved through filler addition.
2Strength
If filler components are added to high temperature polymers to produce electrically conductive and high strength compositions, then electrical conductivity and strength are improved, but homogeneous distribution and dispersion are reduced
Solution Approach 1:
The processing aid acts as a mediator that facilitates uniform dispersion of filler particles throughout the polymer matrix. By modifying the interfacial interactions between polymer and filler, the processing aid prevents agglomeration and ensures homogeneous distribution of both conductive and strengthening fillers, thereby maintaining composition stability.
Solution Approach 2:
The processing aid changes the rheological and surface energy parameters of the polymer-filler system, enabling better wetting and dispersion of filler particles. This parameter modification ensures that filler components remain uniformly distributed throughout the composition during processing and curing.
3Ease of manufacture
If low temperature polymers are used for additive manufacturing, then ease of processing is improved, but temperature resistance and material strength are reduced
Solution Approach 1:
The patent employs composite materials consisting of high temperature polymer matrices reinforced with both conductive fillers (such as carbon black, graphite, or metal particles) and strengthening fillers (such as glass fibers or carbon fibers). This composite structure provides both the high temperature resistance and mechanical strength required for high-temperature applications while maintaining processability through the addition of processing aids.
Data Source
AI summary
A composite material for use as a deposition material in an additive manufacturing system comprises a polymer component, a filler component, and an extrudability component. The extrudability component is present in the composite material is an amount of from 0.05 wt % to 10 wt % based on the weight of the composite material, and can comprise polyhedral oligomeric silsesquioxane (POSS). The polymer component comprises a high temperature polymer such as an engineering polymer or a high performance polymer. The filler component comprises at least one of a conductive component and a strengthening component. In some cases, the conductive component is present in an amount such that the composite material is formed as one of an electrostatic discharge (ESD) material and an EMI/EMC shielding material. The composite material can be deposited in a liquid state on a substrate using an additive manufacturing system, to produce a three-dimensional object.