Conductive Polymer Landing Pad for Semiconductor Alignment
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Solution Overview
Problem
The scaling down of semiconductor devices poses challenges in achieving improved performance, quality, and yield due to issues such as misalignment and defect formation during the fabrication process.
Innovation Solution
A semiconductor device is fabricated with a substrate, dielectric layer, and a plug having a protruding portion, where a conductive polymer landing pad with a wider width is formed over the dielectric layer, and a barrier layer is optionally included between the plug and the dielectric layer, using techniques like etching and deposition to align and pattern the conductive polymer layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the dimensions of semiconductor devices are scaled down to meet increasing computing demand, then device density and computing ability are improved, but misalignment and defect formation occur during fabrication, impacting quality and yield
Solution Approach 1:
The patent applies preliminary action by forming a conductive polymer layer on the protruding portion of the plug before subsequent capacitor structure fabrication. This conductive polymer layer serves as a preliminary structure that facilitates better alignment and reduces misalignment issues during later fabrication steps, directly addressing the manufacturing precision problem while maintaining device scaling benefits
2Productivity
If the dimensions of semiconductor devices are scaled down, then device density is improved, but defect formation increases during the fabrication process
Solution Approach 1:
The patent applies parameter changes by introducing a conductive polymer material with specific electrical and physical properties that are optimized for scaled-down device dimensions. The conductive polymer layer's unique parameters (conductivity, adhesion, flexibility) enable reliable capacitor structure formation at smaller dimensions, reducing defect formation while maintaining high device density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wider landing pad reduces misalignment between capacitor structures and contacts, enhancing the yield and reducing defects, thereby improving the overall performance and quality of the semiconductor device.
Implementation Method 1
radiating charged particle beams through the patterned hole of the mask to form a patterned conductive polymer
Data Source
AI summary
The present application discloses a semiconductor device with a landing pad of conductive polymer and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a dielectric layer disposed over the substrate, a plug disposed in the dielectric layer, and a landing pad of conductive polymer disposed over the dielectric layer. The method includes: providing a substrate; forming a dielectric layer with a plug over the substrate; performing an etching process to remove a portion of the dielectric layer to expose a protruding portion of the plug; forming a conductive polymer layer covering the dielectric layer and the protruding portion; and performing a thermal process to form a landing pad over the dielectric layer in a self-aligned manner. The landing pad of conductive polymer comprises a protruding portion of the plug, a first silicide layer disposed over the protruding portion, and a second silicide layer disposed on a sidewall of the protruding portion.