Conductive Polymer Lid for Sensor Package RF Shielding
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Solution Overview
Problem
Current sensor packages face challenges in providing adequate radio frequency (RF) shielding while maintaining acoustic performance and stress/vibration isolation, often resulting in reduced sensitivity or increased noise due to limited back volume and poor isolation.
Innovation Solution
A conductive polymer lid is used to form a cavity in the sensor package, which is electrically coupled to the substrate, eliminating the need for additional RF shielding coatings and allowing for improved acoustic sealing and signal reception.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a formed metal lid or molded plastic lid with conductive metal plating is used, then RF shielding is provided, but the acoustic performance and back volume are limited
Solution Approach 1:
The patent uses a conductive polymer material that combines the RF shielding properties of conductive materials with the acoustic benefits of polymer materials. This composite material allows for larger back volume while maintaining effective RF shielding, resolving the contradiction between RF shielding requirements and acoustic volume needs.
2Object-affected harmful factors
If a formed metal lid or molded plastic lid with conductive metal plating is used, then RF shielding is provided, but the manufacturing complexity increases
Solution Approach 1:
By using a conductive polymer as a single integrated material instead of combining metal or plated plastic components, the manufacturing process is simplified. The conductive polymer can be molded directly into the desired shape, eliminating the need for separate plating operations or metal forming processes.
Solution Approach 2:
The conductive polymer lid serves multiple functions simultaneously: it provides RF shielding, maintains acoustic seals, and allows for larger back volume. This multi-functionality reduces the number of separate components needed, thereby simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive polymer lid provides effective RF shielding and acoustic isolation, enhancing the sensitivity and noise ratio of sensor packages by allowing for a larger back volume and improved access to the acoustic chamber.
Implementation Method 1
radio frequency (RF) shielding may be required to protect the package from interference from electromagnetic noise signals
Implementation Method 2
cavities for stress or vibration isolation (i.e., gyroscopes) or to provide acoustic volume
Data Source
AI summary
A semiconductor device has a base substrate having a plurality of metal traces. A conductive polymer cover is provided having an opening. The conductive polymer cover forms a cavity when attached to the base substrate. At least one die is attached to an interior surface of the conductive polymer cover and positioned over the opening. The conductive polymer cover and the at least one die are electrically coupled to metal traces on the first surface of the base substrate.