Multilayer Conductive Polymer Stack for High Conductivity Stability

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Solution Overview

Problem

Formulating conductive polymers in insulating materials like resins reduces or degrades their electrical conductivity, making them unsuitable for applications requiring high conductivity levels.

Innovation Solution

A multilayer stack is formed by interposing conductive polymer layers treated with conductivity enhancers between insulating layers, which maintains high electrical conductivity and provides protective encapsulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conductive polymer is formulated in insulating resin materials, then flexibility and compatibility with other materials are improved, but electrical conductivity is reduced or degraded

Engineering Contradiction:
Improveflexibility and compatibilityVSAvoidelectrical conductivity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent divides the conductive polymer structure into multiple separate layers rather than formulating it in resin. Each conductive polymer layer is deposited as a distinct entity between insulating layers, maintaining its intrinsic conductivity while providing flexibility through the layered architecture. This segmentation allows each layer to perform its specific function without compromising the other property.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates a composite multilayer structure combining conductive polymer layers with insulating layers. This composite approach allows the conductive layers to maintain high conductivity while the insulating layers provide flexibility and compatibility with other materials. The composite structure achieves both properties simultaneously by combining different materials in a layered configuration rather than mixing them.

Inventive Principle:
Principle #40Composite materials

2Reliability

If conductivity enhancer is applied to increase electrical conductivity, then electrical conductivity is improved by 6 orders of magnitude, but brittleness is increased making the polymer unsuitable for some applications

Engineering Contradiction:
Improveelectrical conductivityVSAvoidflexibility
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent segments the conductive polymer into multiple thin layers deposited between insulating layers. This segmentation allows the conductive polymer to achieve high conductivity through the stacking effect while each individual layer remains thin and flexible. The multilayer configuration prevents brittleness by distributing the conductive function across multiple flexible layers rather than requiring a single thick brittle layer.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses thin film deposition techniques to create conductive polymer layers that are inherently flexible due to their thinness. By depositing the conductive polymer as thin films between insulating layers, the structure maintains flexibility while achieving the desired conductivity levels through the cumulative effect of multiple layers, avoiding the brittleness associated with thick conductive polymer formulations.

Inventive Principle:
Principle #30Flexible shells and thin films

3Reliability

If multiple conductive polymer layers are stacked to achieve specific electrical resistance levels, then electrical conductivity is improved, but device complexity is increased

Engineering Contradiction:
Improveelectrical conductivity and resistance controlVSAvoidnumber of layers
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent makes each conductive polymer layer serve multiple functions: providing electrical conductivity, enabling flexibility, and contributing to the overall electrical resistance characteristics. The insulating layers also serve multiple functions including electrical insulation, structural support, and flexibility enhancement. This multi-functionality reduces the need for additional specialized components, offsetting the complexity of the multilayer structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent controls electrical resistance by varying parameters such as the number of conductive layers, the thickness of each layer, and the deposition conditions rather than creating fundamentally different structures. By adjusting these parameters, the desired electrical resistance levels are achieved through systematic variation of existing layer characteristics, minimizing the need for complex additional components or structures.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the electrical conductivity of the conductive polymer layers while maintaining stability, allowing for the achievement of specific electrical resistance levels and enabling applications such as de-icing and electromagnetic interference shielding.

Implementation Method 1

Each conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source coupled to the aircraft, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

A multilayer stack of conductive polymer layers and insulating layers disposed on or proximate to a surface of a component

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Data Source

PatentEP3506325B1Multilayer stack comprising conductive polymer layers with enhanced conductivity and stability and fabrication method therefor
Publication Date: 2025.04.09 THE BOEING CO
  • EP3506325B1 patent drawingFigure 1~4
  • EP3506325B1 patent drawingFigure 5
  • EP3506325B1 patent drawingFigure 6~7

AI summary

An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance. (Fig. 9)