Conductive Porous Ceramic Substrate for Antistatic Vacuum Chuck
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional porous ceramic substrates used in semiconductor processing lack antistatic performance, leading to static electricity-induced defects and high manufacturing costs due to complex processing and high replacement rates, while existing solutions either complicate manufacturing or hinder vacuum adsorption.
Innovation Solution
A conductive porous ceramic substrate is developed by doping titanium oxide (TiO2) with MnCO3 and Cr2O3 powders, mixed with graphite, and sintered at a lower temperature, achieving both porosity for vacuum adsorption and conductivity for electrostatic prevention, with a microstructure of Mn- and Cr-doped TiO2-x particles and (Mn,Cr)TiO3 particles, allowing for efficient electrostatic protection and easy surface restoration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a porous ceramic substrate is used as a chuck for fixing semiconductor wafers, then vacuum adsorption capability is achieved, but static electricity is generated causing defects
Solution Approach 1:
The invention changes the electrical parameter of the porous ceramic substrate by doping it with conductive materials (such as graphite, metal powders, or conductive ceramics) to reduce its electrical resistance from insulating levels (>10^12 Ω·cm) to conductive levels (<10^6 Ω·cm), thereby preventing static electricity generation while maintaining vacuum adsorption capability
Solution Approach 2:
The invention creates a composite porous ceramic material by combining traditional ceramic powders (alumina, zirconia, silicon carbide) with conductive additives (graphite, metal powders, or conductive ceramic powders) in specific ratios, achieving both mechanical strength for vacuum adsorption and electrical conductivity for static prevention
2Ease of manufacture
If conventional porous ceramic substrates are used, then manufacturing cost is reduced, but static electricity causes high defect rates and replacement frequency
Solution Approach 1:
The invention modifies the electrical resistance parameter of the porous ceramic substrate through doping with conductive materials, transforming it from a non-conductive to a conductive state, which prevents static electricity-induced defects and reduces wafer breakage during processing
Solution Approach 2:
The invention makes the porous ceramic substrate itself conductive through doping, eliminating the need for expensive conductive coatings that can be damaged. The substrate becomes inherently antistatic, reducing replacement frequency and long-term costs despite initial doping material expenses
3Object-affected harmful factors
If conductive coating is applied to metal stage, then antistatic performance is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts the conductive function from a separate coating layer and integrates it directly into the porous ceramic substrate material itself through doping, eliminating the need for additional coating processes and reducing manufacturing complexity
Solution Approach 2:
The invention merges the structural function (vacuum adsorption) and the electrical function (static prevention) into a single integrated porous ceramic substrate, eliminating the need for separate conductive coatings or additional functional layers
4Object-affected harmful factors
If carbon nanotube coating film is formed on stage body, then antistatic performance is achieved, but manufacturing cost increases and replacement is needed when coating is damaged
Solution Approach 1:
The invention extracts the conductive function from a separate carbon nanotube coating layer and integrates it directly into the porous ceramic substrate material itself through doping, eliminating the need for additional coating processes and reducing manufacturing complexity
Solution Approach 2:
The invention makes the porous ceramic substrate itself conductive through doping, eliminating the need for expensive conductive coatings that can be damaged. The substrate becomes inherently antistatic, reducing replacement frequency and long-term costs despite initial doping material expenses
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate effectively prevents static electricity, supports large-area thin substrates, and reduces manufacturing costs and energy consumption, with a long lifespan and consistent porosity and conductivity, enabling safe vacuum adsorption and integration without the need for full substrate replacement.
Implementation Method 1
doping titanium oxide (TiO2) with MnCO3 and Cr2O3 powders, mixed with graphite, and sintered at a lower temperature
Implementation Method 2
sintering the shaped body thus obtained at a temperature ranging from 1000° C. to 1300° C. in an ambient air atmosphere
Implementation Method 3
The body of the porous ceramic substrate has large numbers of fine pores through which air passes
Data Source
AI summary
The present invention relates to a conductive porous ceramic substrate and a method of manufacturing the same, and more particularly to a conductive porous ceramic substrate, in which a porous ceramic substrate used as a chuck or stage for fixing a thin semiconductor wafer substrate or display substrate through vacuum adsorption is imparted with antistatic performance so as to prevent the generation of static electricity, and a method of manufacturing the same.